4″上BAW谐振腔的集体制造sc切割石英晶圆片

A. Zarzycki, X. Vacheret, O. Bel, D. Picchedda, J. Boy
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摘要

在本文中,我们报告了在4″SC-cut石英晶圆上集体制造谐振器的新结果,设计工作频率约为10mhz。在这个框架中,它们的球面曲率已经变成了由两个(或三个)步骤组成的离散形状。为了制作所提出的设计,研究了两种独立的方法:在两种不同的蚀刻剂中进行深反应离子干蚀刻(DRIE)和湿化学蚀刻。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Collective fabrication of BAW resonators on 4″ SC-cut quartz wafers
In this paper we report new results on collective fabrication of resonators, designed to work at about ten MHz, on 4″ SC-cut quartz wafer. In this frame, their spherical curvature has been changed into discretized shape composed on two (or three) steps. For fabrication of the proposed design, two independent methods were investigated: - deep reactive ion dry etching (DRIE) and - wet chemical etching in two different etchants.
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