热应力引起的SMD封装裂纹失效分析

2021 6th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2021-10-22 DOI:10.1109/ICICM54364.2021.9660253

Haiming Zhang, Zhaoxi Wu, Meng Meng, Xu Wang, Zhimin Ding, Chao Duan, Liwei Han, Fangyuan Li

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引用次数: 0

摘要

表面贴装器件(SMD)封装因其体积小、热阻低等优点，正成为应用最广泛的大功率半导体器件封装形式之一。然而，当安装在PCB上时，SMD封装将遭受更大的热应力，因为它没有引出端子，直接焊接到PCB上。本文介绍了SMD-0.5封装器件在封装陶瓷中出现应力断裂的失效分析案例。通过分析发现，封装裂纹是在电路板组件温度循环过程中产生的。通过对陶瓷特性的分析，认为陶瓷与PCB板之间的热失配是导致失效的原因。此外，通过仿真和实验分析了PCB热膨胀系数和焊点形貌对封装陶瓷裂纹的影响。最后，对SMD封装器件的应用提出了建议。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Analysis of Crack Failure in SMD Package Caused by Thermal Stress

The surface mount device (SMD) packaging is becoming one of the most widely used high-power semiconductor device packaging forms because of its small size and low thermal resistance. However, the SMD package will suffer greater thermal stress when mounted on the PCB, because it has no lead-out terminals and is soldered to the PCB directly. This paper introduces a failure analysis case of a SMD-0.5 packaged device with stress fracture in the ceramic of package. Through analysis, it is found that package cracks occurred during the temperature cycling of the circuit board assembly. Based on the analysis of ceramic characteristics, the cause of the failure is the thermal mismatch between ceramic and PCB. In addition, the paper analyzes the influence of the PCB’s thermal expansion coefficient and solder joint morphology on the cracks of the package ceramic through simulation and experiments. Finally, the paper gives application suggestions for SMD packaged devices.

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2021 6th International Conference on Integrated Circuits and Microsystems (ICICM)

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