重新评估InGaAs用于逻辑:亚10nm鳍宽finfet的迁移率提取

Xiaowei Cai, A. Vardi, J. Grajal, J. D. del Alamo
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引用次数: 7

摘要

我们研究了InGaAs finfet的性能下降,因为它们的翅片宽度低于10纳米。这通常归因于固有输运参数的退化。然而,高频测量表明,随着翅片宽度的缩小,氧化物捕获的情况越来越严重。脉冲- iv测量证实了这一点。一种新的利用s参数和DC-IV同步测量的迁移率提取方法避免了氧化物捕获的影响,并揭示了薄沟道InGaAs平面mosfet和窄宽度finfet的迁移率前景。我们的研究表明,InGaAs finfet的性能下降在很大程度上是一种可以设计的外在现象,并且深度缩放InGaAs finfet的潜在性能被大大低估了。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reassessing InGaAs for Logic: Mobility Extraction in sub-10nm Fin-Width FinFETs
We study the performance degradation of InGaAs FinFETs as they scale to sub-10 nm fin width. This is often attributed to degradation in intrinsic transport parameters. High frequency measurements, however, indicate increasingly severe oxide trapping as the fin width narrows. This is confirmed by pulsed-IV measurements. A new mobility extraction method using concurrent S-parameter and DC-IV measurements avoids the impact of oxide trapping and reveals promising mobility in thin-channel InGaAs planar MOSFETs and narrow-width FinFETs. Our study suggests that performance degradation of InGaAs FinFETs is largely an extrinsic phenomenon that can be engineered around and that the potential performance of deeply-scaled InGaAs FinFETs is significantly underestimated.
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