超薄栅极氧化物中电压驱动击穿模型的实验证据

P. Nicollian, W. Hunter, J.C. Hu
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引用次数: 122

摘要

我们进行了一个实验,证明了广泛接受的E-field TDDB模型在物理上是超薄栅极氧化物击穿的不正确描述。虽然界面陷阱是在5v应力下主要的SILC机制,但击穿仍然受到大量陷阱产生的限制,并且是电压驱动的。最近有人提出,阳极孔注入模型在低电压下仍然有效。虽然我们将证明空穴确实会产生大块陷阱并导致超薄氧化物的破裂,但空穴注入并不能完全解释在直接隧道应力过程中观察到的所有陷阱产生机制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Experimental evidence for voltage driven breakdown models in ultrathin gate oxides
We have performed an experiment proving that the widely accepted E-field TDDB model is a physically incorrect description of breakdown in ultrathin gate oxides. Although interface traps are the dominant SILC mechanism below 5 V stress, breakdown remains limited by bulk trap generation and is voltage-driven. It has been recently proposed that the anode hole injection model is still operative at low voltages. Although we will show that holes do generate bulk traps and cause breakdown in ultrathin oxides, hole injection does not completely account for all of the trap generation mechanisms observed during direct tunneling stress.
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