Cu单晶塑性流动的不稳定性及动态再结晶

A. Korbel, W. Bochniak, L. Błaż, J. Embury
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引用次数: 7

摘要

摘要本文介绍了Cu单晶的高温实验结果。在900℃下,以平行于{123}或偏离{111}晶面14°的轧制平面对晶体进行变形。在前者中,滑移事件均匀地分布在样品中。然后没有观察到再结晶。当晶体偏离{111}面14°时,晶体变形不均匀,形成大量剪切带。结果表明,剪切带密度随应变的增加而增大,剪切带内发生再结晶。根据光学和电子显微镜所显示的结构特征,讨论了剪切带形变晶体的动态再结晶模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Instability of plastic flow and dynamic recrystallization in Cu single crystals
Abstract The present paper shows the results of high temperature experiments performed on Cu single crystals. The crystals were deformed by rolling at 900°C with the rolling plane either parallel to {123} or 14° off the {111} crystal plane. In the former, slip events were evenly distributed in the samples. No recrystallization was then observed. For the crystals which were 14° off the {111} plane, the deformation was non-uniform and numerous shear bands were formed. It was found that the density of shear bands increased with strain, and recrystallization initiated within the shear bands. A model of dynamic recrystallization in crystals deforming by the shear band mode is discussed in terms of the structural features revealed by optical and electron microscopy.
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