基于tsv的电磁电感器三维集成建模

2015 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) Pub Date : 2015-07-01 DOI:10.1109/IMWS-AMP.2015.7324959

Jie Zheng, Dawei Wang, Wensheng Zhao, Gaofeng Wang, W. Yin

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引用次数: 7

摘要

提出并研究了基于tsv的电磁电感器的电路模型。在测量的基础上，可以提取出相关的集总电路元件，它们通过RL阶梯与工作频率无关。因此，电路模型与SPICE模拟器兼容。在电路模型的基础上，研究了设计参数对质量因数和电感的影响。最后，对基于tsv的电磁电感进行了频率-热分析。

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Modeling of TSV-based solenoid inductors for 3-D integration

Circuit model for TSV-based solenoid inductors is presented and investigated. Based on the measurement, the related lumped circuit elements can be extracted, and they are independent of the operating frequency by virtue of the RL ladder. Hence, the circuit model is compatible with the SPICE simulators. Based on the circuit model, the impacts of design parameters on the quality factor and inductance are studied. Finally, the frequency-thermal analysis of TSV-based solenoid inductors is carried out.

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来源期刊

2015 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

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