印刷电子材料与工艺研究进展

B. Ong
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引用次数: 2

摘要

在过去的十年里,人们对印刷电子产品的兴趣激增,因为它有可能创造出有影响力的大面积、轻质、柔性和超低成本的电子产品。为了实现这一技术愿景,通过高通量卷对卷印刷制造半导体器件,而不是缓慢的批量光刻工艺,将是至关重要的。印刷电子产品为各种半导体设备提供了低成本和环保的制造方法,包括下一代显示器,超低成本rfid,智能标签/包装,传感器和图像等。在推动制造业范式转变的关键因素中,最重要的是实现性能的材料套件和制造功能晶体管的兼容工艺-现代微电子的基本构建模块。本演讲讨论了印刷电子关键材料和工艺的问题、挑战和最新进展,以及这一新兴技术的前景。它旨在阐明印刷电子产品是否都是幻想和炒作,还是创新,以及对我们这个时代和未来有影响的商业价值的机会。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Progress in Materials and Processes for Printed Electronics
The interest in printed electronics has exploded over the last decade owing to its potential for creating impactful large-area, lightweight, flexible, and ultra-low-cost electronics. To realize this technology vision, manufacture of semiconductor devices by high-throughput roll-to-roll printing, instead of slow batch-wise photolithographic processes, would be paramount. Printed electronics offers a low-cost and eco-friendlier manufacturing approach to a wide range of semiconductor devices including next-gen displays, ultra-low-cost RFIDs, smart labels/packaging, sensors and images, etc. Foremost among critical enablers to propel this paradigm shift in manufacturing is a performance-fulfilling materials suite and compatible processes for fabricating functionally-capable transistors – the fundamental building blocks of modern microelectronics. This presentation discusses the issues, challenges, and recent advances in critical materials and processes for printed electronics and the outlook for this emerging technology moving forward. It aims to shed light on whether printed electronics is all fantasy and hype or innovation and opportunities of impactful commercial values for our times and beyond.
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