通过控制放置的标准单元存储阵列的功率、面积和性能优化

A. Teman, D. Rossi, P. Meinerzhagen, L. Benini, A. Burg
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引用次数: 48

摘要

就硅面积、功耗和性能而言,嵌入式存储器仍然是当前集成电路设计的主要瓶颈;然而,静态随机存取存储器(sram)几乎完全由少数供应商通过存储器生成器提供,目标是相当通用的设计规范。作为替代方案,标准单元存储器(scm)可以定义、合成、放置和路由为给定数字系统的一个组成部分,提供完整的设计灵活性、良好的能效、低电压操作,甚至小存储块的面积效率。然而,使用标准数字流实现SCM块通常无法利用这种阵列的独特和规则结构,从而留下了优化的空间。在本文中,我们提出了一种设计方法,用于优化SCM宏的物理实现,作为标准设计流程的一部分。该方法引入了可控布局,实现了结构化、非拥堵布局,布局利用率接近100%,与没有控制布局的scm相比,硅占地面积更小,导线长度更短,功耗更低。该方法在最先进的28nm完全耗尽绝缘体上硅技术的各种尺寸和纵横比的SCM宏上进行了演示,并与使用非控制标准流程设计的等效宏以及代工厂提供的SRAM宏进行了比较。与非控制实现相比,受控scm的面积平均减少了25%,同时实现了比SRAM宏更小的1Kbyte。通常发现的256 × 32 (1 Kbyte)存储器的控制SCM块与代工厂提供的SRAM的功率和性能比较分别显示读写功率降低65%和10%以上,同时提供比SRAM更快的访问,尽管其宽高比通常对SCM不利。此外,单片机模块在电源电压低至0.3V时正常工作,远低于为低压操作优化的SRAM宏的下限。控制放置方法应用于基于openrisc的测试芯片的全芯片物理实现流程中,与基准应用程序下同等大小的编译sram相比,可提供50%以上的功耗降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Power, Area, and Performance Optimization of Standard Cell Memory Arrays Through Controlled Placement
Embedded memory remains a major bottleneck in current integrated circuit design in terms of silicon area, power dissipation, and performance; however, static random access memories (SRAMs) are almost exclusively supplied by a small number of vendors through memory generators, targeted at rather generic design specifications. As an alternative, standard cell memories (SCMs) can be defined, synthesized, and placed and routed as an integral part of a given digital system, providing complete design flexibility, good energy efficiency, low-voltage operation, and even area efficiency for small memory blocks. Yet implementing an SCM block with a standard digital flow often fails to exploit the distinct and regular structure of such an array, leaving room for optimization. In this article, we present a design methodology for optimizing the physical implementation of SCM macros as part of the standard design flow. This methodology introduces controlled placement, leading to a structured, noncongested layout with close to 100% placement utilization, resulting in a smaller silicon footprint, reduced wire length, and lower power consumption compared to SCMs without controlled placement. This methodology is demonstrated on SCM macros of various sizes and aspect ratios in a state-of-the-art 28nm fully depleted silicon-on-insulator technology, and compared with equivalent macros designed with the noncontrolled, standard flow, as well as with foundry-supplied SRAM macros. The controlled SCMs provide an average 25% reduction in area as compared to noncontrolled implementations while achieving a smaller size than SRAM macros of up to 1Kbyte. Power and performance comparisons of controlled SCM blocks of a commonly found 256 × 32 (1 Kbyte) memory with foundry-provided SRAMs show greater than 65% and 10% reduction in read and write power, respectively, while providing faster access than their SRAM counterparts, despite being of an aspect ratio that is typically unfavorable for SCMs. In addition, the SCM blocks function correctly with a supply voltage as low as 0.3V, well below the lower limit of even the SRAM macros optimized for low-voltage operation. The controlled placement methodology is applied within a full-chip physical implementation flow of an OpenRISC-based test chip, providing more than 50% power reduction compared to equivalently sized compiled SRAMs under a benchmark application.
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