Quad Flat No Lead封装(QFN)对自动x射线检测(AXI)的影响

2007 IEEE International Test Conference Pub Date : 2007-10-01 DOI:10.1109/TEST.2007.4437601

Tee Chwee Liong, Andy Pascual

{"title":"Quad Flat No Lead封装(QFN)对自动x射线检测(AXI)的影响","authors":"Tee Chwee Liong, Andy Pascual","doi":"10.1109/TEST.2007.4437601","DOIUrl":null,"url":null,"abstract":"QFN is increasingly being used on wireless cards, handhelds etc. However, QFN unique solder joints pose great challenges for AXI. This paper discusses lack of industry specification for QFN inspection, how AXI methodology was improved to detect QFN solder joint defect, design for inspection and future work.","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2007-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Impact of Quad Flat No Lead package (QFN) on automated X-ray inspection (AXI)\",\"authors\":\"Tee Chwee Liong, Andy Pascual\",\"doi\":\"10.1109/TEST.2007.4437601\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"QFN is increasingly being used on wireless cards, handhelds etc. However, QFN unique solder joints pose great challenges for AXI. This paper discusses lack of industry specification for QFN inspection, how AXI methodology was improved to detect QFN solder joint defect, design for inspection and future work.\",\"PeriodicalId\":6403,\"journal\":{\"name\":\"2007 IEEE International Test Conference\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE International Test Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.2007.4437601\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.2007.4437601","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

QFN越来越多地应用于无线网卡、手持设备等。然而，QFN独特的焊点给AXI带来了巨大的挑战。本文讨论了QFN检测缺乏行业规范，如何改进AXI方法来检测QFN焊点缺陷，检测设计和未来的工作。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Impact of Quad Flat No Lead package (QFN) on automated X-ray inspection (AXI)

QFN is increasingly being used on wireless cards, handhelds etc. However, QFN unique solder joints pose great challenges for AXI. This paper discusses lack of industry specification for QFN inspection, how AXI methodology was improved to detect QFN solder joint defect, design for inspection and future work.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2007 IEEE International Test Conference

自引率

0.00%

发文量