仿真及其与测试的连接

Kenneth Larsen
{"title":"仿真及其与测试的连接","authors":"Kenneth Larsen","doi":"10.1109/TEST.2014.7035338","DOIUrl":null,"url":null,"abstract":"As electronic chip designs are predominately System-On-Chip (SoC), hardware emulation has become a crucial tool for pre-silicon hardware and software validation. Pre-silicon emulation models are often available many quarters before tapeout and are used in many areas such as OS boot, software driver development, and system stress and performance testing. Increasingly hardware emulation is used in the development of test contents and to verify the quality of tools and processes used in post-silicon testing. This presentation will cover how hardware emulation aids pre- and post-silicon testing and debugging of SoC infrastructure functions for testability, reliability, and repairability.","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2014-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Emulation and its connection to test\",\"authors\":\"Kenneth Larsen\",\"doi\":\"10.1109/TEST.2014.7035338\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As electronic chip designs are predominately System-On-Chip (SoC), hardware emulation has become a crucial tool for pre-silicon hardware and software validation. Pre-silicon emulation models are often available many quarters before tapeout and are used in many areas such as OS boot, software driver development, and system stress and performance testing. Increasingly hardware emulation is used in the development of test contents and to verify the quality of tools and processes used in post-silicon testing. This presentation will cover how hardware emulation aids pre- and post-silicon testing and debugging of SoC infrastructure functions for testability, reliability, and repairability.\",\"PeriodicalId\":6403,\"journal\":{\"name\":\"2007 IEEE International Test Conference\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE International Test Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.2014.7035338\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.2014.7035338","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

由于电子芯片设计主要是片上系统(SoC),硬件仿真已成为预硅硬件和软件验证的重要工具。预硅仿真模型通常在tapout之前的许多季度可用,并用于许多领域,例如OS引导、软件驱动程序开发以及系统压力和性能测试。硬件仿真越来越多地用于测试内容的开发和验证后硅测试中使用的工具和过程的质量。本演讲将介绍硬件仿真如何帮助SoC基础设施功能的可测试性、可靠性和可修复性的硅前和硅后测试和调试。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Emulation and its connection to test
As electronic chip designs are predominately System-On-Chip (SoC), hardware emulation has become a crucial tool for pre-silicon hardware and software validation. Pre-silicon emulation models are often available many quarters before tapeout and are used in many areas such as OS boot, software driver development, and system stress and performance testing. Increasingly hardware emulation is used in the development of test contents and to verify the quality of tools and processes used in post-silicon testing. This presentation will cover how hardware emulation aids pre- and post-silicon testing and debugging of SoC infrastructure functions for testability, reliability, and repairability.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信