铝表面镀锡的热老化研究

B. Chudnovsky, V. Pavageau, M. Rapeaux, A. Zolfaghari, P. Bardollet
{"title":"铝表面镀锡的热老化研究","authors":"B. Chudnovsky, V. Pavageau, M. Rapeaux, A. Zolfaghari, P. Bardollet","doi":"10.1109/HOLM.2007.4318199","DOIUrl":null,"url":null,"abstract":"This paper presents a thermal study of aluminum with tin plating deposited on Al using three different types of tin plating using various cyanide and non-cyanide processes. We determined the quality of plating before and after it was exposed to the temperature of 150degC in air for up to eight weeks using multiple testing techniques, such as adhesion test, thermal shock test, SEM techniques, EDS X-ray analysis, and thickness measurements. We determined that after aging test tin plating shows aging related cracks, voids and separation appearing at the plating interfaces although in different concentration and progression rates depending on plating technique. All types of plating demonstrated deteriorated plating adhesion. Accelerated thermal aging tests at 150degC discriminate plating types. Aged samples exhibit medium to poor adhesion characteristics, and these results are likely related to the plating process itself. At the origin of this behavior, we might suggest thermal- induced mechanisms including formation of intermetallics and diffusion, presence of impurities at the plating-bar interface, defect propagation and stress relaxation at the interface.","PeriodicalId":11624,"journal":{"name":"Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2007-09-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal Aging Study of Tin plating on Aluminum\",\"authors\":\"B. Chudnovsky, V. Pavageau, M. Rapeaux, A. Zolfaghari, P. Bardollet\",\"doi\":\"10.1109/HOLM.2007.4318199\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a thermal study of aluminum with tin plating deposited on Al using three different types of tin plating using various cyanide and non-cyanide processes. We determined the quality of plating before and after it was exposed to the temperature of 150degC in air for up to eight weeks using multiple testing techniques, such as adhesion test, thermal shock test, SEM techniques, EDS X-ray analysis, and thickness measurements. We determined that after aging test tin plating shows aging related cracks, voids and separation appearing at the plating interfaces although in different concentration and progression rates depending on plating technique. All types of plating demonstrated deteriorated plating adhesion. Accelerated thermal aging tests at 150degC discriminate plating types. Aged samples exhibit medium to poor adhesion characteristics, and these results are likely related to the plating process itself. At the origin of this behavior, we might suggest thermal- induced mechanisms including formation of intermetallics and diffusion, presence of impurities at the plating-bar interface, defect propagation and stress relaxation at the interface.\",\"PeriodicalId\":11624,\"journal\":{\"name\":\"Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-09-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HOLM.2007.4318199\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOLM.2007.4318199","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文采用三种不同的镀锡工艺,采用不同的氰化和非氰化工艺,对铝表面镀锡铝的热性能进行了研究。我们使用多种测试技术,如附着力测试、热冲击测试、扫描电镜技术、EDS x射线分析和厚度测量,确定了在空气中暴露于150℃温度长达8周之前和之后的镀层质量。在时效试验后,镀锡界面上出现了与时效相关的裂纹、空洞和分离现象,尽管其浓度和发展速度随镀工艺的不同而不同。所有类型的镀层都表现出镀层附着力变差。在150℃下进行加速热老化试验,以区分镀层类型。老化样品表现出中等到较差的粘附特性,这些结果可能与电镀工艺本身有关。在这种行为的起源,我们可能认为热诱导的机制包括金属间化合物的形成和扩散,在镀棒界面上杂质的存在,界面上缺陷的传播和应力松弛。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal Aging Study of Tin plating on Aluminum
This paper presents a thermal study of aluminum with tin plating deposited on Al using three different types of tin plating using various cyanide and non-cyanide processes. We determined the quality of plating before and after it was exposed to the temperature of 150degC in air for up to eight weeks using multiple testing techniques, such as adhesion test, thermal shock test, SEM techniques, EDS X-ray analysis, and thickness measurements. We determined that after aging test tin plating shows aging related cracks, voids and separation appearing at the plating interfaces although in different concentration and progression rates depending on plating technique. All types of plating demonstrated deteriorated plating adhesion. Accelerated thermal aging tests at 150degC discriminate plating types. Aged samples exhibit medium to poor adhesion characteristics, and these results are likely related to the plating process itself. At the origin of this behavior, we might suggest thermal- induced mechanisms including formation of intermetallics and diffusion, presence of impurities at the plating-bar interface, defect propagation and stress relaxation at the interface.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信