CMOS VLSIC可靠性快速热分析

Yi-Kan Cheng, S. Kang
{"title":"CMOS VLSIC可靠性快速热分析","authors":"Yi-Kan Cheng, S. Kang","doi":"10.1109/CICC.1996.510601","DOIUrl":null,"url":null,"abstract":"In this paper, we present a fast thermal reliability diagnosis tool (iTHREAD) for CMOS VLSI chips. Unlike existing circuit-level electrothermal simulators, it finds the steady-state temperature distribution, the hot spots, as well as the resulting power consumptions in an extremely efficient way. By using a fast timing simulator with accurate temperature-dependent device models and a novel 3-D analytical thermal simulator, it can easily handle very large circuits. With iTHREAD, temperature-dependent reliability and timing problems of VLSICs can be accurately and quickly predicted. It can be further applied to guide the module placement, timing verification, and many other IC reliability diagnoses.","PeriodicalId":74515,"journal":{"name":"Proceedings of the ... Custom Integrated Circuits Conference. Custom Integrated Circuits Conference","volume":"60 1","pages":"479-482"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Fast thermal analysis for CMOS VLSIC reliability\",\"authors\":\"Yi-Kan Cheng, S. Kang\",\"doi\":\"10.1109/CICC.1996.510601\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we present a fast thermal reliability diagnosis tool (iTHREAD) for CMOS VLSI chips. Unlike existing circuit-level electrothermal simulators, it finds the steady-state temperature distribution, the hot spots, as well as the resulting power consumptions in an extremely efficient way. By using a fast timing simulator with accurate temperature-dependent device models and a novel 3-D analytical thermal simulator, it can easily handle very large circuits. With iTHREAD, temperature-dependent reliability and timing problems of VLSICs can be accurately and quickly predicted. It can be further applied to guide the module placement, timing verification, and many other IC reliability diagnoses.\",\"PeriodicalId\":74515,\"journal\":{\"name\":\"Proceedings of the ... Custom Integrated Circuits Conference. Custom Integrated Circuits Conference\",\"volume\":\"60 1\",\"pages\":\"479-482\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the ... Custom Integrated Circuits Conference. Custom Integrated Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CICC.1996.510601\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the ... Custom Integrated Circuits Conference. Custom Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.1996.510601","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

本文提出了一种用于CMOS VLSI芯片的快速热可靠性诊断工具(iTHREAD)。与现有的电路级电热模拟器不同,它以一种非常有效的方式发现稳态温度分布、热点以及由此产生的功耗。通过使用具有精确温度相关器件模型的快速时序模拟器和新颖的三维分析热模拟器,它可以轻松处理非常大的电路。使用iTHREAD,可以准确快速地预测vlsic的温度依赖性可靠性和时序问题。它可以进一步应用于指导模块放置,定时验证和许多其他IC可靠性诊断。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fast thermal analysis for CMOS VLSIC reliability
In this paper, we present a fast thermal reliability diagnosis tool (iTHREAD) for CMOS VLSI chips. Unlike existing circuit-level electrothermal simulators, it finds the steady-state temperature distribution, the hot spots, as well as the resulting power consumptions in an extremely efficient way. By using a fast timing simulator with accurate temperature-dependent device models and a novel 3-D analytical thermal simulator, it can easily handle very large circuits. With iTHREAD, temperature-dependent reliability and timing problems of VLSICs can be accurately and quickly predicted. It can be further applied to guide the module placement, timing verification, and many other IC reliability diagnoses.
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CiteScore
3.80
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