基于能耗比的深亚微米缺陷检测

B. Vinnakota
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引用次数: 8

摘要

技术的进步和一体化程度的提高预计会降低I/sub ddq/测试的有效性。每个集成电路的总泄漏电流预计会非常大,因此很难检测到单个缺陷的影响(T.W. Williams等人,1996;M. Sachdev, 1997)。通过监测动态电源电流来检测故障的测试方法已被建议作为一种替代方法。文献中提出的几乎所有动态电流技术都受到工艺变化的不利影响。许多在测量中也容易受到时间和幅度误差的影响。能量消耗比(ECR)是一种新的基于电流的动态测试指标(B. Vinnakota et al., 1998),它解决了其中的一些问题。与其他动态测试方法和I/sub ddq/测试相比,基于ecr的测试提供了几个优势,例如对过程变化的容忍度,降低了测试过程的复杂性,以及检测其他技术无法检测到的故障的能力。ECR已经通过广泛的模拟和50K栅极亚微米生物医学IC的应用得到验证(W. Jiang和B. Vinnakota, 1999)。我们的贡献是为了进一步验证ECR的真实质量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Deep submicron defect detection with the energy consumption ratio
Advances in technology and increasing integration are expected to degrade the effectiveness of I/sub ddq/ test. Total leakage currents per IC are expected to be very large, making it difficult to detect the impact of a single defect (T.W. Williams et al., 1996; M. Sachdev, 1997). Test methods which detect faults by monitoring the dynamic supply current have been suggested as one alternative. Almost all the dynamic current techniques proposed in the literature are adversely affected by the impact of process variations. Many are also susceptible to timing and magnitude errors in measurement. The energy consumption ratio (ECR) is a new dynamic current-based test metric (B. Vinnakota et al., 1998), that addresses some of these problems. ECR-based test offers several advantages over other dynamic test methods and the I/sub ddq/ test such as tolerance to process variations, reduced test process complexity and a proven ability to detect faults that escape other techniques. The ECR has been validated through extensive simulation and through application to a 50K gate sub-micron biomedical IC (W. Jiang and B. Vinnakota, 1999). Our contributions are directed towards further validating the real quality of the ECR.
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