Y. Lepikh, T. Lavrenova, V. Borshchak, N. Sadova, N. Zatovskaya
{"title":"恢复和保护低温焊料免于氧化","authors":"Y. Lepikh, T. Lavrenova, V. Borshchak, N. Sadova, N. Zatovskaya","doi":"10.1109/ukrmico47782.2019.9165324","DOIUrl":null,"url":null,"abstract":"The analyzes of methods and composition of solder protection from oxidation has been carried out. A more perfect composition for the restoring and protection of the melt of low-temperature solder from oxidation on the basis of fluxing components: glycerin; urea; nano-dispersed carbon and filler (silicon dioxide powder) has been developed.The advantage of the developed composition (material) is an increase in operating time (from 2-3 to 300 hours). Unlike the protective fluids based on glycerol with sodium hydroxide salts, or hardening oils, the operation temperature range increases to 447 K - 723 K, the cleaning and removal of the remains of the protective composition improves. High dispersion of SiO2 (5-15 microns) and highly developed surface (5-150 m2 /g) of technical carbon lead to increase the strength and reduced the porosity of the protective layer, which prevents the evaporation of heavy (toxic) metals in the solder composition.The developed material is tested in the technology of assembly and installation of radio electronic products by soldering method and can be used for low-temperature soldering and tinning conductors by the low-melting solders, as well as electric outlets, radio elements and units of electronic equipment (EE).","PeriodicalId":6754,"journal":{"name":"2019 International Conference on Information and Telecommunication Technologies and Radio Electronics (UkrMiCo)","volume":"177 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Restoring and protection of the low temperature solder from oxidation\",\"authors\":\"Y. Lepikh, T. Lavrenova, V. Borshchak, N. Sadova, N. Zatovskaya\",\"doi\":\"10.1109/ukrmico47782.2019.9165324\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The analyzes of methods and composition of solder protection from oxidation has been carried out. A more perfect composition for the restoring and protection of the melt of low-temperature solder from oxidation on the basis of fluxing components: glycerin; urea; nano-dispersed carbon and filler (silicon dioxide powder) has been developed.The advantage of the developed composition (material) is an increase in operating time (from 2-3 to 300 hours). Unlike the protective fluids based on glycerol with sodium hydroxide salts, or hardening oils, the operation temperature range increases to 447 K - 723 K, the cleaning and removal of the remains of the protective composition improves. High dispersion of SiO2 (5-15 microns) and highly developed surface (5-150 m2 /g) of technical carbon lead to increase the strength and reduced the porosity of the protective layer, which prevents the evaporation of heavy (toxic) metals in the solder composition.The developed material is tested in the technology of assembly and installation of radio electronic products by soldering method and can be used for low-temperature soldering and tinning conductors by the low-melting solders, as well as electric outlets, radio elements and units of electronic equipment (EE).\",\"PeriodicalId\":6754,\"journal\":{\"name\":\"2019 International Conference on Information and Telecommunication Technologies and Radio Electronics (UkrMiCo)\",\"volume\":\"177 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International Conference on Information and Telecommunication Technologies and Radio Electronics (UkrMiCo)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ukrmico47782.2019.9165324\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Information and Telecommunication Technologies and Radio Electronics (UkrMiCo)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ukrmico47782.2019.9165324","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
对焊料防氧化的方法和组成进行了分析。在助焊剂成分的基础上,用于恢复和保护低温焊料熔体免受氧化的更完美的组合物:甘油;尿素;纳米分散碳及其填料(二氧化硅粉)得到了发展。开发的组合物(材料)的优点是操作时间增加(从2-3小时到300小时)。与基于氢氧化钠盐的甘油或硬化油的保护液不同,操作温度范围增加到447 K - 723 K,改善了保护成分残留物的清洁和去除。高度分散的SiO2(5-15微米)和高度发达的表面(5- 150m2 /g)技术碳导致强度增加,减少了保护层的孔隙率,从而防止了焊料成分中重金属(有毒)的蒸发。所研制的材料在无线电电子产品的焊接装配和安装工艺中进行了试验,可用于低温焊料的低温焊接和镀锡导体,也可用于电源插座、无线电元件和电子设备(EE)的单元。
Restoring and protection of the low temperature solder from oxidation
The analyzes of methods and composition of solder protection from oxidation has been carried out. A more perfect composition for the restoring and protection of the melt of low-temperature solder from oxidation on the basis of fluxing components: glycerin; urea; nano-dispersed carbon and filler (silicon dioxide powder) has been developed.The advantage of the developed composition (material) is an increase in operating time (from 2-3 to 300 hours). Unlike the protective fluids based on glycerol with sodium hydroxide salts, or hardening oils, the operation temperature range increases to 447 K - 723 K, the cleaning and removal of the remains of the protective composition improves. High dispersion of SiO2 (5-15 microns) and highly developed surface (5-150 m2 /g) of technical carbon lead to increase the strength and reduced the porosity of the protective layer, which prevents the evaporation of heavy (toxic) metals in the solder composition.The developed material is tested in the technology of assembly and installation of radio electronic products by soldering method and can be used for low-temperature soldering and tinning conductors by the low-melting solders, as well as electric outlets, radio elements and units of electronic equipment (EE).