兼容电子学:鲁棒印刷设备的最新发展

RAN Pub Date : 2017-04-01 DOI:10.11159/ICNNFC17.2
C. Simão
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引用次数: 0

摘要

印刷电子技术和混合器件具有在薄、柔性和弹性基板上结合紧凑的高性能电路集成的潜力。在柔性显示器、智能标签、光伏器件、传感器件和射频识别(RFID)标签等实际应用中,混合印刷电子器件的可靠性和鲁棒性是实现该技术的主要挑战。特别是,刚性元件和软基板之间的界面是由于机械不相容而产生的主要问题。我们最近的工作重点是克服这一缺点,通过强调研究材料的弹性作用及其沉积过程,包括油墨,粘合剂和密封剂。此外,该策略通过将可拉伸性提升到弹性,确定了面向兼容设备的方向。在这次演讲中,材料,包括基材,导电油墨,基于银或碳纳米颗粒,加工和固化和沉积技术,如丝网和喷墨印刷在实验室规模的片到片,直到工业化前的卷到卷,除了最近的发展,从符合皮肤湿度传感器到LED混合弹性系统展示。描述过程和特性,包括机械应变下的电气性能和环境条件的稳定性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Conformable Electronics: Recent Developments towards RobustPrinted Devices
Printed Electronics technology and hybrid devices have the potential to combine compact high-performance circuit integration on thin, flexible and elastic substrates. Reliability and robustness of hybrid printed electronics is a major challenge for the implementation of the technology in practical applications such as flexible displays, smart labels, photovoltaic devices, sensing devices, and radio frequency identification (RFID) tags. Particularly, interfaces between the rigid components and the soft substrates represent the major issue due to mechanical incompatibility. Our recent work has focused on overcoming this drawback, by emphasizing the study of materials elasticity role and their deposition process, both for inks, adhesives and encapsulants. Furthermore, this strategy settles the direction towards conformable devices, by promoting stretchability up to elasticity. In this talk, materials, including substrates, conductive inks, based on silver or carbon nanoparticles, processing and curing and deposition techniques such as screen and inkjet printing in lab scale sheet to sheet up to pre-industrial roll to roll are discussed, in addition to recent developments in demonstrators ranging from conformable skin moisture sensor to LED hybrid elastic systems are presented, depicting processes and characterization involving electrical performance under mechanical strain and stability to ambient conditions.
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