考虑工艺变化的统计老化分析

Sangwoo Han, Joohee Choung, Byung-Su Kim, B. Lee, Hungbok Choi, Juho Kim
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引用次数: 16

摘要

随着CMOS器件的小型化,工艺和老化变化成为影响电路可靠性和良率的主要问题。本文分析了工艺变化对热载流子注入(HCI)和负偏置温度不稳定性(NBTI)等老化效应的影响。利用基于蒙特卡罗的晶体管级模拟,包括主成分分析(PCA),考虑了工艺变化与老化变化之间的相关性。与忽略相关性的其他方法相比,分析的准确性得到了提高(2-7%),特别是在较小的技术中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Statistical aging analysis with process variation consideration
As CMOS devices become smaller, process and aging variations become a major issue for circuit reliability and yield. In this paper, we analyze the effects of process variations on aging effects such as hot carrier injection (HCI) and negative bias temperature instability (NBTI). Using Monte-Carlo based transistor-level simulations including principal component analysis (PCA), the correlations between process variations and aging variations are considered. The accuracy of analysis is improved (2–7%) compared to other methods in which the correlations are ignored, especially in smaller technologies.
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