{"title":"基于有限元分析和红外图像的模具加热组件接触热阻研究","authors":"B. Seo, Changmin Park","doi":"10.3795/ksme-b.2022.46.8.453","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":43823,"journal":{"name":"Transactions of the Korean Society of Mechanical Engineers B","volume":"1 1","pages":""},"PeriodicalIF":0.2000,"publicationDate":"2022-08-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Study on Contact Thermal Resistance of a Mold Heating Assembly Using Finite Element Analysis and Infrared Image\",\"authors\":\"B. Seo, Changmin Park\",\"doi\":\"10.3795/ksme-b.2022.46.8.453\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":43823,\"journal\":{\"name\":\"Transactions of the Korean Society of Mechanical Engineers B\",\"volume\":\"1 1\",\"pages\":\"\"},\"PeriodicalIF\":0.2000,\"publicationDate\":\"2022-08-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Transactions of the Korean Society of Mechanical Engineers B\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.3795/ksme-b.2022.46.8.453\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Transactions of the Korean Society of Mechanical Engineers B","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.3795/ksme-b.2022.46.8.453","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}