AlGaN通道层中Si掺杂对N极AlGaN/AlN fet性能的影响

Taketo Kowaki, W. Matsumura, Koki Hanasaku, Ryo Okuno, Daisuke Inahara, S. Matsuda, S. Kurai, Yongzhao Yao, Y. Ishikawa, N. Okada, Y. Yamada
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引用次数: 0

摘要

氮极性(N极性)AlGaN/AlN结构有望比传统的金属极性AlGaN/GaN电子器件具有更高的载流子密度,并且AlN衬底具有各种优势,例如高击穿电压和高温工作。本文成功制备了具有静态场效应晶体管特性的N极AlGaN/AlN异质结构场效应晶体管(FET)。然而,漏极电流密度IDS仍然非常小。本研究旨在通过在各种条件下在最上层的AlGaN通道层中掺杂Si来改善IDS。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Si‐Doping Effects in AlGaN Channel Layer on Performance of N‐Polar AlGaN/AlN FETs
The nitrogen‐polar (N‐polar) AlGaN/AlN structure is expected to have higher carrier density than conventional metal‐polar AlGaN/GaN electronic devices, and the AlN substrate offers various advantages, such as high breakdown voltage and high‐temperature operation. Herein, a N‐polar AlGaN/AlN‐heterostructured field‐effect transistor (FET) with static FET characteristics is successfully fabricated. However, the drain current density, IDS, remains significantly small. This study aims to improve IDS by doping Si in the topmost AlGaN channel layer under various conditions.
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