二阶温度补偿压电驱动的23 MHz重掺杂硅谐振器,温度稳定性为±10 ppm

A. Jaakkola, P. Pekko, J. Dekker, M. Prunnila, T. Pensala
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引用次数: 3

摘要

我们报道了压电驱动的硅MEMS谐振器的石英级温度稳定性。在T = -40…的温度范围内,23 MHz扩展模谐振器的频率稳定性优于±10 ppm。+ 85°C。温度补偿机制完全是被动的,依赖于n > 1020cm-3掺杂水平的重掺杂硅的定制弹性特性,以及优化的谐振腔几何结构。该结果突出了硅MEMS谐振器作为石英晶体的引脚到引脚兼容替代品的潜力,而无需任何主动温度补偿。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Second order temperature compensated piezoelectrically driven 23 MHz heavily doped silicon resonators with ±10 ppm temperature stability
We report quartz level temperature stability of piezoelectrically driven silicon MEMS resonators. Frequency stability of better than ±10 ppm is measured for 23 MHz extensional mode resonators over a temperature range of T = -40 ... + 85°C. The temperature compensation mechanism is entirely passive, relying on the tailored elastic properties of heavily doped silicon with a doping level of n > 1020cm-3, and on an optimized resonator geometry. The result highlights the potential of silicon MEMS resonators to function as pin-to-pin compatible replacements for quartz crystals without any active temperature compensation.
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