自愈电致伸缩聚合物的制备及机电性能分析

Z. Zhang, Youyuan Wang, Xiaosong Zhu, Yudong Li, Hongrui Gu
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引用次数: 0

摘要

自愈电致伸缩材料的发展有助于提高柔性电子器件的寿命。本文研究了一种极性弹性体修饰介电弹性体,在室温下实现了剪切损伤的自修复。将甲基巯基乙酸甲酯(MG)接枝到苯乙烯-丁二烯-苯乙烯(SBS)嵌段共聚物上,通过点击化学反应制得MG-SBS材料。利用拉伸测试、力学动态热分析和宽带介电光谱分析了MG-SBS的性能。研究表明,CH/$\pi$键能使MG-SBS材料实现剪切损伤的自愈。MG-SBS在较低温度下接近丙烯酸的电致伸缩性能。电致伸缩性能的温度稳定性是其独特的优点。该材料将有助于提高柔性电子器件的损伤自愈能力和温度适应性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Preparation and Electromechanical Performance Analysis of Self-healing Electrostrictive Polymer
The development of self-healing electrostrictive materials is helpful to improve the life of flexible electronic devices. In this paper, a polar elastomer-modified dielectric elastomer has achieved self-healing of shear damage at room temperature. The MG-SBS material was obtained by grafting methyl methyl thioglycolate (MG) onto styrene-butadiene- styrene (SBS) block copolymer by click chemical reaction. Tensile testing, mechanical dynamic thermal analysis, and broadband dielectric spectroscopy were used to analyze the performance of MG-SBS. Studies have shown that the CH/$\pi$ bond enables MG-SBS materials to achieve self-healing of shear damage. MG-SBS is close to the electrostrictive properties of acrylic at lower temperature. The temperature stability of the electrostrictive performance is its unique advantage. The material will help improve the damage self-healing ability and temperature adaptability of flexible electronic devices.
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