14 nm栅长n型MOSFET的建模

Z. A. N. Faizah, I. Ahmad, P. J. Ker, P. S. Akmaa Roslan, A. Maheran
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引用次数: 14

摘要

金属氧化物半导体场效应晶体管mosfet (mosfet)晶体管自1974年以来已经通过摩尔定律进行了巨大的缩放,以便在单个芯片中压缩晶体管。因此,必须采用适当的标度技术来最小化短信道效应问题。本文介绍了14nm HfO2/WSi2 n型MOSFET器件的虚拟制造设计和器件特性。该器件是基于先前对32纳米晶体管的研究而缩小的。利用虚拟晶圆制造(VWF) Silvaco TCAD工具ATHENA和ATLAS实现了n型mosfet的虚拟制造和仿真。仿真结果表明,阀值电压(VTH)、驱动电流(ION)和泄漏电流(IOFF)的最优值分别为0.232291 V、78.922×10-6 A/um和77.11×10-9 A/um。这些模拟结果被认为能够在即将进行的工作中为利用高k /金属栅极n型MOSFET优化和制造14nm器件的栅极长度创造试金石。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Modeling of 14 nm gate length n-Type MOSFET
Metal-Oxide-Semiconductor Field Effect Transistors MOSFETs (MOSFETs) transistor have been scaled tremendously through Moore's Law since 1974 in order to compact transistors in a single chip. Thus, a proper scaling technique is compulsory to minimize the short channel effect (SCE) problems. In this paper, the virtual fabricated design and device's characterization of 14 nm HfO2/WSi2 n-type MOSFET device is presented. The device is scaled based on previous research on 32 nm transistors. The virtual fabrication and simulation of n-type MOSFETs are implemented using Virtual Wafer Fabrication (VWF) Silvaco TCAD Tools named ATHENA and ATLAS. From the simulation, result shows that the optimal value of threshold voltage (VTH), drive current (ION) and leakage current (IOFF) are 0.232291 V, 78.922×10-6 A/um and 77.11×10-9 A/um respectively. These simulation results are believed to be able to create a touchstone towards the optimization and fabrication of 14 nm device's gate length utilizing High-K/Metal Gate n-type MOSFET in impending work.
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