用EELS和电子全息法测量非晶SiO2的厚度

Chang-Woo Lee, Y. Ikematsu, D. Shindo
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引用次数: 4

摘要

讨论了电子能量损失谱(EELS)和电子全息法测量非晶二氧化硅厚度的准确性。由于在这项工作中所研究的二氧化硅粒子具有球形,因此可以很容易地评估入射电子束的局部厚度。因此,从EELS中确定了在200kV下非弹性散射的平均自由程为178±4nm。认为用EELS测量厚度仅限于厚度大于20 nm的非晶sio2薄膜。另一方面,从电子全息图的相移来看,平均内电位为11.5±0.3 V。认为利用电子全息技术可以测量到几纳米的厚度。从而指出,电子全息术在比EELS更薄的区域可以精确测量厚度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thickness measurement of amorphous SiO2 by EELS and electron holography
The accuracy of electron energy-loss spectroscopy (EELS) and electron holography on thickness measurement of amorphous SiO 2 was discussed. Since the SiO 2 particles investigated in this work have a spherical shape, local thickness along the incident electron beam can easily be evaluated. Thus, from EELS, the mean free path of inelastic scattering was determined to be 178 ± 4nm at 200kV. It is considered that thickness measurement is limited to amorphous SiO 2 film thicker than about 20 nm with EELS. On the other hand, from phase shift in the electron hologram, the mean inner potential was evaluated to be 11.5 ± 0.3 V. It is suggested that the thickness measurement is possible up to a few nanometers with electron holography. Thus, it is pointed out that the accurate thickness measurement is possible for a thinner region wilt electron holography than EELS.
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