{"title":"典型焊面/焊料组合PBGA焊点热系数寿命预测","authors":"Hongqin Wang, Qingqiu Gong, Dawei Wang, Wei Li, Ziqiang Xu, Jinbao Cai","doi":"10.1109/ICEPT47577.2019.245204","DOIUrl":null,"url":null,"abstract":"The degradation characteristics and life prediction of the typical PCB Pad/solder pastes combinations including the ENIG PCB pad /lead-free BGA SAC305 ball with lead-free process, the Sn-HASL PCB pad/lead-free BGA SAC305 ball with backward compatible mixing process and the Sn-HASL PCB pad/lead-tin BGA 63SnPb ball with lead-tin process were investigated and compared based on the accelerated life experiments. The data of thermal cycle to failure was processed and it was confirmed that the thermal cycle to failure of the investigated three type solder joints all could be fitted by Weibull distribution law.","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"1 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal Fitigure Life Prediction on PBGA Solder Joints of Typical Pad Finish/Solder Combination\",\"authors\":\"Hongqin Wang, Qingqiu Gong, Dawei Wang, Wei Li, Ziqiang Xu, Jinbao Cai\",\"doi\":\"10.1109/ICEPT47577.2019.245204\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The degradation characteristics and life prediction of the typical PCB Pad/solder pastes combinations including the ENIG PCB pad /lead-free BGA SAC305 ball with lead-free process, the Sn-HASL PCB pad/lead-free BGA SAC305 ball with backward compatible mixing process and the Sn-HASL PCB pad/lead-tin BGA 63SnPb ball with lead-tin process were investigated and compared based on the accelerated life experiments. The data of thermal cycle to failure was processed and it was confirmed that the thermal cycle to failure of the investigated three type solder joints all could be fitted by Weibull distribution law.\",\"PeriodicalId\":6676,\"journal\":{\"name\":\"2019 20th International Conference on Electronic Packaging Technology(ICEPT)\",\"volume\":\"1 1\",\"pages\":\"1-5\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 20th International Conference on Electronic Packaging Technology(ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT47577.2019.245204\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT47577.2019.245204","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal Fitigure Life Prediction on PBGA Solder Joints of Typical Pad Finish/Solder Combination
The degradation characteristics and life prediction of the typical PCB Pad/solder pastes combinations including the ENIG PCB pad /lead-free BGA SAC305 ball with lead-free process, the Sn-HASL PCB pad/lead-free BGA SAC305 ball with backward compatible mixing process and the Sn-HASL PCB pad/lead-tin BGA 63SnPb ball with lead-tin process were investigated and compared based on the accelerated life experiments. The data of thermal cycle to failure was processed and it was confirmed that the thermal cycle to failure of the investigated three type solder joints all could be fitted by Weibull distribution law.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
