半导体制造中的订单释放方法:科学的最新进展和工业的经验教训

Jacob Lohmer, Christian Flechsig, R. Lasch, K. Schmidt, Benjamin Zettler, G. Schneider
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引用次数: 4

摘要

这篇文章提出了一个行业案例研究,以及对半导体行业晶圆制造中订单释放方法的最新科学分析。订单进入晶圆厂会显著影响关键参数,如在制品、周期时间和吞吐量。我们研究了目前在工业中应用的工艺,指出了这种订单释放方法对高混合、大批量晶圆厂性能的影响,并建立了与所分析的科学文献的联系,以开发一个有意义的自动化释放决策的概念。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Order Release Methods in Semiconductor Manufacturing: State-of-the-Art in Science and Lessons from Industry
This contribution presents an industry case study as well as an analysis of the state-of-the-art in science concerning order release methods in wafer manufacturing in the semiconductor industry. The release of orders into the fab significantly influences critical parameters such as WIP, cycle time and throughput. We examine the processes currently applied in industry, indicate the effects of this order release approach on the performance of high-mix, high-volume fabs and establish a link to the analyzed scientific literature to develop a concept for meaningful automation of the release decision.
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