电流密度对镍电沉积Ni20Cr合金钎料润湿性的影响

A. Kumarasiri, H.S. Herath, D. Amarasinghe, D. Attygalle
{"title":"电流密度对镍电沉积Ni20Cr合金钎料润湿性的影响","authors":"A. Kumarasiri, H.S. Herath, D. Amarasinghe, D. Attygalle","doi":"10.1109/MERCon52712.2021.9525762","DOIUrl":null,"url":null,"abstract":"Nickel-chromium alloys are in high demand in the electrical industry, as they have some favorable electrical properties. The formation of a thin chromium oxide layer on the alloy surface protects the alloy from further oxidation. The passivation layer formation is almost instantaneous when exposed to the ambient atmosphere. It prevents the strong bonding between the solder and the substrate due to the alteration of the substrate's surface energy by the passivation layer. Poor solderability could cause short-circuiting and resistance variations in electrical devices. This paper reviews the effect on solderability due to the passive layer formation and proposes solutions to overcome the problems caused by this layer. The introduction of solder-compatible metal layers such as Ni onto the substrate surface is a way to overcome this. However, solder-compatible metals such as Ni cannot be introduced with conventional electroplating baths due to the alloy's passive behavior. Therefore, a breakdown of the passivity is required before the nickel coating. A three-bath electrodeposition strategy comprising; pre-cleaning, activation, and electroplating, were used to achieve the task. The study examines the dependency of solder wettability on the current density, using an in-house fabricated contact-angle measuring device and analytical software.","PeriodicalId":6855,"journal":{"name":"2021 Moratuwa Engineering Research Conference (MERCon)","volume":"7 1","pages":"649-653"},"PeriodicalIF":0.0000,"publicationDate":"2021-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effects of Current Density on the Solder Wettability of Nickel Electrodeposited Ni20Cr Alloy\",\"authors\":\"A. Kumarasiri, H.S. Herath, D. Amarasinghe, D. Attygalle\",\"doi\":\"10.1109/MERCon52712.2021.9525762\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Nickel-chromium alloys are in high demand in the electrical industry, as they have some favorable electrical properties. The formation of a thin chromium oxide layer on the alloy surface protects the alloy from further oxidation. The passivation layer formation is almost instantaneous when exposed to the ambient atmosphere. It prevents the strong bonding between the solder and the substrate due to the alteration of the substrate's surface energy by the passivation layer. Poor solderability could cause short-circuiting and resistance variations in electrical devices. This paper reviews the effect on solderability due to the passive layer formation and proposes solutions to overcome the problems caused by this layer. The introduction of solder-compatible metal layers such as Ni onto the substrate surface is a way to overcome this. However, solder-compatible metals such as Ni cannot be introduced with conventional electroplating baths due to the alloy's passive behavior. Therefore, a breakdown of the passivity is required before the nickel coating. A three-bath electrodeposition strategy comprising; pre-cleaning, activation, and electroplating, were used to achieve the task. The study examines the dependency of solder wettability on the current density, using an in-house fabricated contact-angle measuring device and analytical software.\",\"PeriodicalId\":6855,\"journal\":{\"name\":\"2021 Moratuwa Engineering Research Conference (MERCon)\",\"volume\":\"7 1\",\"pages\":\"649-653\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-07-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 Moratuwa Engineering Research Conference (MERCon)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MERCon52712.2021.9525762\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 Moratuwa Engineering Research Conference (MERCon)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MERCon52712.2021.9525762","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

镍铬合金具有良好的电性能,在电气工业中需求量很大。在合金表面形成一层薄薄的氧化铬层,可以防止合金进一步氧化。当暴露在环境大气中时,钝化层的形成几乎是瞬间的。它可以防止由于钝化层改变衬底的表面能而导致焊料和衬底之间的牢固结合。不良的可焊性可能导致电气设备短路和电阻变化。本文综述了钝化层的形成对可焊性的影响,并提出了克服钝化层造成的问题的解决方法。在衬底表面引入可焊兼容的金属层(如Ni)是克服这一问题的一种方法。然而,由于合金的被动行为,镍等与焊料兼容的金属不能用传统的电镀液引入。因此,在镀镍之前需要对钝化度进行分解。三浴电沉积策略包括;通过预清洗、活化和电镀来完成任务。该研究使用内部制造的接触角测量装置和分析软件检查焊料润湿性对电流密度的依赖关系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of Current Density on the Solder Wettability of Nickel Electrodeposited Ni20Cr Alloy
Nickel-chromium alloys are in high demand in the electrical industry, as they have some favorable electrical properties. The formation of a thin chromium oxide layer on the alloy surface protects the alloy from further oxidation. The passivation layer formation is almost instantaneous when exposed to the ambient atmosphere. It prevents the strong bonding between the solder and the substrate due to the alteration of the substrate's surface energy by the passivation layer. Poor solderability could cause short-circuiting and resistance variations in electrical devices. This paper reviews the effect on solderability due to the passive layer formation and proposes solutions to overcome the problems caused by this layer. The introduction of solder-compatible metal layers such as Ni onto the substrate surface is a way to overcome this. However, solder-compatible metals such as Ni cannot be introduced with conventional electroplating baths due to the alloy's passive behavior. Therefore, a breakdown of the passivity is required before the nickel coating. A three-bath electrodeposition strategy comprising; pre-cleaning, activation, and electroplating, were used to achieve the task. The study examines the dependency of solder wettability on the current density, using an in-house fabricated contact-angle measuring device and analytical software.
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