非晶硅应变片的温度补偿

S.G. Ferguson, W.E. Spear
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引用次数: 2

摘要

探讨了非晶硅作为应变片材料的应用潜力。测量了光放电等离子体在抛光不锈钢衬底上沉积的a- si /a- sinx薄膜结构的测量因子K。单轴应变下掺磷a-Si的电导变化导致室温K值在- 20和- 40之间,这取决于施加在衬底上的电位。通过场效应对K的控制,原则上可以补偿规范因子的温度系数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Temperature compensation of amorphous silicon strain gauges

The applied potential of amorphous silicon as a strain gauge material has been investigated. Measurements of the gauge factor, K, were carried out on a-Si/a-SiNx thin-film structures deposited from a glow discharge plasma on polished stainless steel substrates. The conductance changes of phosphorus-doped a-Si under uniaxial strain lead to room temperature K values between −20 and −40, depending on the potential applied to the substrate. The control of K by the field effect makes it possible in principle to compensate for the temperature coefficients of the gauge factor.

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