银在聚酰亚胺上自金属化的制备与表征

A. Kareem
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引用次数: 1

摘要

本文采用自催化镀法制备了银(Ag)在聚酰亚胺(PI)薄膜上的自金属化。采用溶液浇铸法制备PI薄膜,然后用氢氧化钾(KOH)溶液蚀刻,用氯化锡(SnCl2)敏化,用氯化钯(PdCl2)活化PI表面。能量色散x射线分析(EDX)显示(Ag)区域的峰值,证实了AgNPs的存在。2θ = 38.2°、44.5°、64.6°和78.2°处的衍射峰分别代表Ag的111、200、220和311面。对银化PI的FT-IR分析表明,在1735 cm−1处,=C-O-C=拉伸吸收带的位置没有变化,只是随着沉积时间的增加,峰的大小发生了显著的变化。在2325和955 cm−1处形成了新的带(N - h拉伸吸收带和N - c拉伸吸收带),表明N原子与银纳米粒子之间具有很强的配位性。1488和1117 cm−1的C-C拉伸和= C-H平面振动带移至1413和1112 cm−1,表明银纳米粒子与聚合物主链相互作用。利用热重分析(TGA)测试了不同沉积时间(5、10和15 min)下PI-和ag -金属化PI膜的热稳定性。对于PI, T0、T5、T10和Tmax分别为388℃、402℃、414℃和515℃。随着沉积时间的增加,热稳定性提高。作为沉积的函数,用扫描电子显微镜(SEM)表征了PI膜上铜层的厚度和表面形貌。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Preparation and characterization of silver self-metallization on polyimide
In this work, silver (Ag) self-metallization on a polyimide (PI) film was prepared through autocatalytic plating. PI films were prepared through the solution casting method, followed by etching with potassium hydroxide (KOH) solution, sensitization with tin chloride (SnCl2), and the use of palladium chloride (PdCl2) to activate the surface of PI. Energy-dispersive X-ray analysis (EDX) showed the highest peak in the (Ag) region and confirmed the presence of AgNPs. The diffraction peaks at 2θ = 38.2°, 44.5°, 64.6°, and 78.2° represented the 111, 200, 220, and 311 planes of Ag, respectively. The FT–IR analysis for Ag-metalized PI showed that the =C-O-C= stretching absorption bands at 1735 cm−1 had no changes in position, only a significant difference in peak size at the deposition time increase. The formation of new bands (N–H stretching absorption band and N–C stretching band) assigned at 2325 and 955 cm−1 indicated strong coordination between N atoms and silver nanoparticles. The C–C stretching and = C–H plane vibration band at 1488 and 1117 cm−1 are shifted to 1413 and 1112 cm−1, indicating the silver nanoparticles' interaction with the polymer backbone. The thermal stability of PI- and Ag-metalized PI films at various deposition times (5, 10, and 15 min) was examined using thermogravimetric analysis (TGA). For PI, T0, T5, T10, and Tmax were observed to be 388°C, 402°C, 414°C, and 515°C, respectively. When the deposition time increased, the thermal stability increased. As a function of the deposition, the thickness and surface morphology of the copper layer on the PI films were characterized using scanning electron microscopy (SEM).
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