Ryusuke Egawa, J. Tada, Yusuke Endo, H. Takizawa, Hiroaki Kobayashi
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Abstract: Exploring Design Space of a 3D Stacked Vector Cache
Although 3D integration technologies with through silicon vias (TSVs) have expected to overcome the memory and power wall problems in the future microprocessor design, there is no promising EDA tools to design 3D integrated VLSIs. In addition, effects of 3D integration on microprocessor design have not been discussed well. Under this situation, this paper presents design approach of 3D stacked cache memories using existing EDA tools, and shows early performances evaluation of 3D stacked cache memories for vector processors.
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