三维热辅助磁记录中的介质层结构

Q3 Engineering
T. Kobayashi, Y. Nakatani, Y. Fujiwara
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引用次数: 0

摘要

我们研究了三维热辅助磁记录(3D HAMR)中每层2 Tbpsi(总密度为4 Tbpsi)的介质层结构,其中介质由高居里温度层(HC)和低居里温度层(LC)组成。本文对含隔离层的三维HAMR介质进行了传热模拟。为了评估颗粒误差分布,利用颗粒误差概率计算磁化期望值。讨论了误码率的误码率阈值和误码率的时间依赖性。利用传热模拟计算的温度分布估计了在LC层写入时HC层的信息稳定性。将LC(上层,即表面)/ HC(下层)层结构与HC(上层)/ LC(下层)层结构进行比较。就HC层的写入而言,前者相对于介质表面温度是不利的。后者对于HC和LC写入的热梯度之间的差异可能是不利的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Medium Layer Structure in Three-Dimensional Heat-Assisted Magnetic Recording
We examine a medium layer structure in three-dimensional heat-assisted magnetic recording (3D HAMR) at 2 Tbpsi per layer (total density of 4 Tbpsi) where the medium consists of a high Curie temperature (HC) layer and a low Curie temperature (LC) layer. We perform a heat transfer simulation for 3D HAMR media including the isolation layer. To evaluate the grain error distribution, the expected value of the magnetization is calculated using the grain error probability. The error threshold and the time dependence of the bit error rate are discussed for 10 years of archiving. The information stability in the HC layer while writing in the LC layer is estimated using the temperature profile calculated by the heat transfer simulation. An LC (upper, namely, surface) / HC (lower) layer structure is compared with an HC (upper) / LC (lower) layer structure. The former is disadvantageous in relation to the medium surface temperature as regards writing in the HC layer. The latter may be disadvantageous in relation to the difference between the thermal gradients for HC and LC writing.
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来源期刊
Journal of the Magnetics Society of Japan
Journal of the Magnetics Society of Japan Engineering-Electrical and Electronic Engineering
CiteScore
2.00
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