{"title":"化学镀铜废料处理工艺","authors":"J. Holly","doi":"10.1108/EB046111","DOIUrl":null,"url":null,"abstract":"Spent electroless copper can plate out in drain lines if the solution is still active when it reaches the overflow valve of the plating tank. This can result in clogged drain lines, necessitating more frequent cleaning and/or replacement. Correcting this problem with chemical additions to deactivate the solution requires careful analysis of the waste treatment process. Here's how one circuit board manufacturer handled the delicate situation.","PeriodicalId":20237,"journal":{"name":"Plating and Surface Finishing","volume":"17 1","pages":"24-27"},"PeriodicalIF":0.0000,"publicationDate":"1990-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"WASTE TREATMENT PROCESS FOR ELECTROLESS COPPER\",\"authors\":\"J. Holly\",\"doi\":\"10.1108/EB046111\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Spent electroless copper can plate out in drain lines if the solution is still active when it reaches the overflow valve of the plating tank. This can result in clogged drain lines, necessitating more frequent cleaning and/or replacement. Correcting this problem with chemical additions to deactivate the solution requires careful analysis of the waste treatment process. Here's how one circuit board manufacturer handled the delicate situation.\",\"PeriodicalId\":20237,\"journal\":{\"name\":\"Plating and Surface Finishing\",\"volume\":\"17 1\",\"pages\":\"24-27\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Plating and Surface Finishing\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1108/EB046111\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Plating and Surface Finishing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1108/EB046111","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Spent electroless copper can plate out in drain lines if the solution is still active when it reaches the overflow valve of the plating tank. This can result in clogged drain lines, necessitating more frequent cleaning and/or replacement. Correcting this problem with chemical additions to deactivate the solution requires careful analysis of the waste treatment process. Here's how one circuit board manufacturer handled the delicate situation.
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