微电子封装用纳米复合焊料的超声分散

Impact Pub Date : 2022-10-26 DOI:10.1109/IMPACT56280.2022.9966718

S. Rajendran, Hyejun Kang, SeongMin Seo, J. Jung

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引用次数: 0

摘要

随着消费类电子产品小型化和便携性的进步，设备有望变得紧凑和轻便，要求通过细间距互连在更小的空间内实现更多的输入输出电传输。用于连接集成电路、微处理器、存储芯片等与印刷电路板(PCB)的球栅阵列(BGA)和倒装球栅阵列(FCBGA)所使用的焊料球直径不断缩小，以满足当前的市场需求[1,2]。

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Ultrasonic dispersion of nanocomposite solder for microelectronic packaging

With the progress in miniaturization and portability of consumer electronics, devices are expected to be compact and lightweight, demanding more input-output electrical transfer in less space via fine-pitch interconnections. The solder ball diameter used in the ball grid array (BGA) and Flip-chip ball grid array (FCBGA) for joining the integrated circuits, microprocessors, memory chips, etc., to printed circuit boards (PCB) is continuously downsized to meet the current market demands [1, 2].

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