Heat Dissipation Material with Alumina Selectively Dispersed Using PS-PMMA Diblock Copolymer

: In order to increase the thermal conductivity of the heat dissipation material, it is necessary to increase the content of alumina, a thermally conductive ceramic filler, and a typical heat dissipation material forms a continuous heat transfer path when the filler content is 50 wt% or more. However, as the content of the ceramic filler increases, the tensile strength of the heat dissipation material decreases, which is an obstacle to commercialization and market expansion. Therefore, in this study, a continuous heat transfer path was formed by selectively dispersing a thermally conductive filler using polystyrene-poly(methyl methacrylate) diblock copolymer and adding carbon nanotubes to an extent capable of maintaining electrical insulation to act as a heat transfer bridge between ceramic fillers. In the end, an electrically insulating heat dissipation material with improved thermal conductivity and tensile strength was manufactured by increasing the heat transfer efficiency of the thermally conductive ceramic filler to form a continuous heat transfer path even when the filler content is 50 wt% or less.