铜电铸UV LIGA技术

IEEE International Vacuum Electronics Conference. International Vacuum Electronics Conference Pub Date : 2014-04-22 DOI:10.1109/IVEC.2014.6857581

Hanyan Li, Xinghui Li, Guodong Bai, Jinjun Feng

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引用次数: 1

摘要

本文研究了电流波形和电流密度对铜薄膜表面形貌和微观结构表征的影响。与直流(DC)波形相比，脉冲波形电镀产生了精细、无空洞的晶粒铜结构。铜膜的晶粒尺寸为194 nm，具有耐高温无气泡的特点。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Copper electroforming for UV LIGA technology

This paper investigates effects of current waveforms and densities on surface morphology and microstructural characterization of copper films. Comparing to the direct current (DC) waveform, the pulse waveform plating produces a fine, void-free grain copper structure. The grain size of copper films is 194 nm and copper films are capable of enduring high temperature without bubbles.

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IEEE International Vacuum Electronics Conference. International Vacuum Electronics Conference

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