Technical Program and Reviewing Committee

Mario Auer, Institute of Electronics, Graz University of Technology, Austria Alexander Bergmann, Institute of Electronic Sensor Systems, Graz University of Technology, Austria Bernd Deutschmann, Institute of Electronics, Graz University of Technology, Austria Dieter Draxelmayr, Infineon Technologies Austria, Austria Martin Horauer, Research Group Embedded Systems, University of Applied Sciences Technikum Wien, Austria Mario Huemer, Institute of Signal Processing, Johannes Kepler University Linz, Austria Michael Hutter, Rambus Technologies, USA Nikolaus Keroe, Oregano Systems, Austria Hans-Peter Kreuter, Infineon Technologies Austria, Austria Manfred Ley, Carinthia University of Applied Sciences, Villach, Austria Christian Netzberger, FH Joanneum, University of Applied Sciences, Kapfenberg, Austria Burkhard Neurauter, eesy-ic, Austria Timm Ostermann, Institute for Integrated Circuits, Johannes Kepler University Linz, Austria Harald Pretl, Institute for Integrated Circuits, Johannes Kepler University Linz, Austria Peter Roessler, Research Group Embedded Systems, University of Applied Sciences Technikum Wien, Austria Gregor Schatzberger, ams AG, Austria Kerstin Schneider-Hornstein, Institute of Electrodynamics, Microwave & Circuit Engineering, Vienna University of Technology, Austria Peter Soeser, Institute of Electronics, Graz University of Technology, Austria Andreas Steininger, Institute of Computer Engineering, Vienna University of Technology, Austria Johannes Sturm, Carinthia University of Applied Sciences, Villach, Austria Gunter Winkler, Institute of Electronics, Graz University of Technology, Austria Johannes Wolkerstorfer, xFace, Graz, Austria Horst Zimmermann, Institute of Electrodynamics, Microwave & Circuit Engineering, Vienna University of Technology, Austria