解决超大规模集成电路平面规划问题的不同方法

YMER Digital Pub Date : 2022-08-17 DOI:10.37896/ymer21.08/46
Leena Jain, Amarbir Singh
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引用次数: 0

摘要

由于VLSI(超大规模集成电路)芯片上的组件数量多年来呈指数增长,因此需要开发自动算法来确定芯片上电路的相对位置。为了提高芯片的性能,在布线阶段必须处理多个目标,包括面积和导线长度。现代非常大规模的集成技术是基于固定轮廓的平面图约束,通常以最小化模块之间的面积和无线为目标。这篇调查论文给出了解决VLSI地板规划问题的各种方法的最新说明。关键词:遗传算法,非切片平面设计,软模块,VLSI平面设计
本文章由计算机程序翻译,如有差异,请以英文原文为准。
DIFFERENT METHODOLOGIES TO SOLVE VLSI FLOORPLANNING PROBLEM
Due to the exponential increase in number of components on a VLSI (Very Large-Scale Integration) chip over the years, there is a need to develop automated algorithms to decide the relative positions of circuits on a chip. In order to improve the performance of a chip, it is essential to deal with multiple objectives including area and wire length during the floor planning phase. Modern very large-scale integration technology is based on fixed-outline floorplan constraints, generally with an objective of minimizing area and wirelength between the modules. This survey paper gives an up-to-date account on various approaches used to solve VLSI floor planning problem. Keywords—Genetic algorithm, Non-slicing floorplan, Soft modules, VLSI floor planning.
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