基于电荷陷阱的伪装门,用于逆向工程预防

Asmit De, Anirudh Iyengar, Mohammad Nasim Imtiaz Khan, Sung-Hao Lin, S. Thirumala, Swaroop Ghosh, S. Gupta
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引用次数: 2

摘要

随着先进的成像和探测技术的发展,知识产权的逆向工程(RE)变得越来越高效。门伪装是一种众所周知的技术,用于防止对手破译芯片设计并窃取IP。以前已经提出了几种伪装方法来阻止RE,例如假过孔和阈值电压调制。然而,这些技术要么成本高昂,要么容易受到背后探测和复杂的光学攻击。在本文中,我们提出了一种基于电荷陷阱的伪装电路设计方法,该方法可以抵御反向探测和光学反射。伪装依赖于伪装门的栅极氧化物处的捕获电荷。它不需要任何流程更改,也不留下任何布局级别的线索。我们提出了两种多功能动态基于电荷陷阱的伪装门(CTCG),即CTCG2和CTCG4,它们分别具有2种和4种不同的逻辑人格。我们利用这种伪装技术来设计一个n阶段的多米诺骨牌逻辑实现。我们进行了CTCG的面积、功率和延迟分析,并与现有的伪装技术进行了比较。仿真结果表明,相对于标准动态门,其平均延迟开销为2X,漏损开销为3.5X,总功率开销为2.2X,面积开销为7.4X。由于CTCG开销高,如果不仔细优化工艺,可能会导致捕获电荷的泄漏,我们建议用非易失性铁电场效应管(NV-FeFET)代替电荷陷阱电路。仿真结果表明,基于nv - ffet的CTCG平均延迟开销为1。7X,漏损开销0.6X,总功率开销0.9X,面积开销2.3X。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
CTCG: Charge-trap based camouflaged gates for reverse engineering prevention
Reverse Engineering (RE) of Intellectual Property (IP) has become increasingly more efficient with sophisticated imaging and probing techniques. Gate camouflaging is a well-known technique used to prevent an adversary from deciphering the chip design and stealing the IP. Several flavors of camouflaging have been previously proposed to thwart RE such as, dummy vias and threshold voltage modulation. However, these techniques are either costly or remain vulnerable to backside probing and sophisticated optical attacks. In this paper, we propose a charge — trap based approach of designing camouflaged circuits, which are resilient to backside probing and optical RE. The camouflaging relies on trapped charges at the gate oxide of the camouflaged gate. It does not require any process change and does not leave any layout-level clue. We propose two multi-function dynamic Charge-Trap-based Camouflaged Gates (CTCG) namely, CTCG2 and CTCG4 that can assume 2 and 4 different logic personalities, respectively. We leverage this camouflaging technique to design an n-stage domino-logic implementation. We perform area, power and delay analysis of CTCG and compare with existing camouflaging techniques. Simulation results show an average delay overhead of 2X, leakage overhead of 3.5X, total power overhead of 2.2X and area overhead of 7.4X with respect to standard dynamic gates. Since CTCG overhead is high and may suffer from leakage of trapped charges if process is not optimized carefully, we propose to replace the charge-trap circuit with a Non-Volatile Ferroelectric FET (NV-FeFET). Simulation results of NV-FeFET based CTCG show an average delay overhead of 1. 7X, leakage overhead of 0.6X, total power overhead of 0.9X and area overhead of 2.3X with respect to standard dynamic gates.
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