作为低压接触材料的Au-Sb和Au-Ag-Sb合金

Bor-Jenq Wang, N. Saka, E. Rabinowicz
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引用次数: 1

摘要

最近的一项调查表明,低压贵金属电触点的接触电阻随着开关循环次数的增加而增加,主要是由于接触表面上的碳积聚。此外,当接触电极由贱金属(如Ni、Fe、Ti和Sb)制成时,即使不能消除碳的形成,也可以延迟碳的形成。在这些金属中,锑被发现是防止碳形成的最佳接触材料。然而,由于Sb具有较高的电阻率和氧化电位,因此不能用作触点材料。因此,决定将贵金属,如Au和Ag与Sb合为合金。在本研究中,制备了各种成分的Au-Sb和Au-Ag-Sb合金,并在室温下在空气-苯混合物中进行了测试。用冲击试验机进行了模拟继电器触点带电负载运行的试验。在所有抑制碳形成的合金中,Au-7 Ag-30 Sb合金被发现是最好的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Au-Sb and Au-Ag-Sb alloys as low-voltage contact materials
A recent investigation has shown that the increase in contact resistance of low-voltage noble-metal electrical contacts with the number of on-off switch cycles is primarily due to carbon build-up on the contact surfaces. Moreover, when the contact electrodes are made of base metals, such as Ni, Fe, Ti and Sb, carbon formation can be delayed, if not eliminated. Among these metals, Sb has been found to be the best contact material against carbon formation. Because of the comparatively higher electrical resistivity and the potential for oxidation, however, Sb cannot be used as a contact material. Therefore, it has been decided to alloy noble metals, such as Au and Ag, with Sb. In this study, Au-Sb and Au-Ag-Sb alloys of various compositions were prepared and tested in air-benzene mixture at room temperature. An impact tester was used for conducting tests that simulate the operation of relay contacts with electrical load. Of all the alloys tested for discouraging carbon formation, the Au-7 Ag-30 Sb alloy was found to be the best.
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