迈向无线单芯片系统:SoC中射频集成的挑战

2003 IEEE Topical Conference on Wireless Communication Technology Pub Date : 2003-10-15 DOI:10.1109/WCT.2003.1321501

S. Raman

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引用次数: 1

摘要

无线通信系统的爆炸性增长导致对紧凑、低成本和低功耗的无线设备的需求增加。为了满足这一需求，需要在同一芯片上结合RF，模拟和数字功能的IC，迅速接近片上系统(SoC)的实现。

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Towards wireless single chip systems: challenges for RF integration in SoC

The corresponding explosive growth in wireless communications systems has led to an increased demand for wireless devices which are compact, low-cost, and low-power. To meet this demand, IC which combine RF, analog, and digital functions on the same chip are required, rapidly approaching system-on-chip (SoC) implementations.

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来源期刊

2003 IEEE Topical Conference on Wireless Communication Technology

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