{"title":"结合数字图像相关(DIC)和原位三维μ- ct分析蠕变载荷下应变与孔隙率的关系","authors":"B. Camin, J. Hornig-Klamroth, N. zu Bentheim","doi":"10.1515/pm-2023-0008","DOIUrl":null,"url":null,"abstract":"Abstract In situ 3D μ-XCT allows the time and space resolved measurement and analysis of material damage in the component volume, whereas the Digital Image Correlation (DIC) is a 2D method for the analysis of deformation measured on the surfaces of components. In situ 3D μ-XCT measurements were performed on cylindrical specimen made of SiC particle reinforced titanium MMC (MMC: Metal Matrix Composite) (15 % SiC particles) during creep load. The formation and evolution of voids were subsequently analyzed. Due to the rotationally symmetric sample geometry, the analysis of the deformation in the interior of the material by DIC using 2D slices is possible and evident. The dot pattern required to calculate the strain using DIC (speckle pattern) is provided by the intrinsic particle reinforcement of the MMCs. Temporally and locally changing and time-variant strain fields in both the tensile as well as the compressive range could be detected correlating with void formation and development area.","PeriodicalId":20360,"journal":{"name":"Practical Metallography","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Combination of Digital Image Correlation (DIC) and in situ 3D-μ-CT in the analysis of the relationship between strains and porosity under creep loading\",\"authors\":\"B. Camin, J. Hornig-Klamroth, N. zu Bentheim\",\"doi\":\"10.1515/pm-2023-0008\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract In situ 3D μ-XCT allows the time and space resolved measurement and analysis of material damage in the component volume, whereas the Digital Image Correlation (DIC) is a 2D method for the analysis of deformation measured on the surfaces of components. In situ 3D μ-XCT measurements were performed on cylindrical specimen made of SiC particle reinforced titanium MMC (MMC: Metal Matrix Composite) (15 % SiC particles) during creep load. The formation and evolution of voids were subsequently analyzed. Due to the rotationally symmetric sample geometry, the analysis of the deformation in the interior of the material by DIC using 2D slices is possible and evident. The dot pattern required to calculate the strain using DIC (speckle pattern) is provided by the intrinsic particle reinforcement of the MMCs. Temporally and locally changing and time-variant strain fields in both the tensile as well as the compressive range could be detected correlating with void formation and development area.\",\"PeriodicalId\":20360,\"journal\":{\"name\":\"Practical Metallography\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-01-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Practical Metallography\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1515/pm-2023-0008\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Practical Metallography","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1515/pm-2023-0008","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
原位三维μ-XCT (In situ μ-XCT)可以对部件体积内的材料损伤进行时间和空间分辨的测量和分析,而数字图像相关(DIC)是一种用于分析部件表面测量变形的二维方法。对SiC颗粒增强钛MMC (MMC:金属基复合材料)(15% SiC颗粒)柱状试样进行蠕变载荷下的原位三维μ-XCT测量。随后分析了孔洞的形成和演化。由于样品的几何形状是旋转对称的,因此可以利用二维的DIC薄片来分析材料内部的变形。利用散斑图(DIC)计算应变所需的点图是由mmc的本征粒子增强提供的。可以检测到与孔隙形成和发育区域相关的拉伸和压缩范围的时、局部变化和时变应变场。
Combination of Digital Image Correlation (DIC) and in situ 3D-μ-CT in the analysis of the relationship between strains and porosity under creep loading
Abstract In situ 3D μ-XCT allows the time and space resolved measurement and analysis of material damage in the component volume, whereas the Digital Image Correlation (DIC) is a 2D method for the analysis of deformation measured on the surfaces of components. In situ 3D μ-XCT measurements were performed on cylindrical specimen made of SiC particle reinforced titanium MMC (MMC: Metal Matrix Composite) (15 % SiC particles) during creep load. The formation and evolution of voids were subsequently analyzed. Due to the rotationally symmetric sample geometry, the analysis of the deformation in the interior of the material by DIC using 2D slices is possible and evident. The dot pattern required to calculate the strain using DIC (speckle pattern) is provided by the intrinsic particle reinforcement of the MMCs. Temporally and locally changing and time-variant strain fields in both the tensile as well as the compressive range could be detected correlating with void formation and development area.