{"title":"用于短毫米波和太赫兹行波管窗口的相对较薄的金刚石薄膜的制备","authors":"M. Ding, Lili Li, Jinjun Feng","doi":"10.1109/IVEC.2014.6857689","DOIUrl":null,"url":null,"abstract":"To improve mechanical properties of relatively thin diamond films used in short mm wave and THz TWT windows, we propose a novel fabrication process, in which an ultra-nanocrystalline diamond (UNCD) process is incorporated into the conventional polycrystalline diamond (PCD) deposition. This paper describes the fabrication method, growing process of UNCD on PCD and improvement in fracture strength of the composite diamond films.","PeriodicalId":88890,"journal":{"name":"IEEE International Vacuum Electronics Conference. International Vacuum Electronics Conference","volume":"10 1","pages":"461-462"},"PeriodicalIF":0.0000,"publicationDate":"2014-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Fabrication of relatively thin diamond films for short mm wave and THz TWT windows\",\"authors\":\"M. Ding, Lili Li, Jinjun Feng\",\"doi\":\"10.1109/IVEC.2014.6857689\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To improve mechanical properties of relatively thin diamond films used in short mm wave and THz TWT windows, we propose a novel fabrication process, in which an ultra-nanocrystalline diamond (UNCD) process is incorporated into the conventional polycrystalline diamond (PCD) deposition. This paper describes the fabrication method, growing process of UNCD on PCD and improvement in fracture strength of the composite diamond films.\",\"PeriodicalId\":88890,\"journal\":{\"name\":\"IEEE International Vacuum Electronics Conference. International Vacuum Electronics Conference\",\"volume\":\"10 1\",\"pages\":\"461-462\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-04-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE International Vacuum Electronics Conference. International Vacuum Electronics Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IVEC.2014.6857689\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE International Vacuum Electronics Conference. International Vacuum Electronics Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IVEC.2014.6857689","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fabrication of relatively thin diamond films for short mm wave and THz TWT windows
To improve mechanical properties of relatively thin diamond films used in short mm wave and THz TWT windows, we propose a novel fabrication process, in which an ultra-nanocrystalline diamond (UNCD) process is incorporated into the conventional polycrystalline diamond (PCD) deposition. This paper describes the fabrication method, growing process of UNCD on PCD and improvement in fracture strength of the composite diamond films.