激光闪蒸法研究AlN与Kovar合金的热接触电阻

IEEE International Vacuum Electronics Conference. International Vacuum Electronics Conference Pub Date : 2015-04-27 DOI:10.1109/IVEC.2015.7223827

Lin Zhang, Yan-ping Lu, B. Du

{"title":"激光闪蒸法研究AlN与Kovar合金的热接触电阻","authors":"Lin Zhang, Yan-ping Lu, B. Du","doi":"10.1109/IVEC.2015.7223827","DOIUrl":null,"url":null,"abstract":"In this paper, the thermal contact resistance of solid interface between AlN and Kovar alloy and some main influencing factors of it were investigated. The thermal contact resistance of the interface between AlN ceramic and Kovar alloy decreases with increasing temperature and increasing pressure respectively, and thermal contact resistance between the unpolished samples is higher than that between polished samples. A function relation between pressure P applied on the AlN ceramic and Kovar alloy interface and the thermal contact resistance R is also presented.","PeriodicalId":88890,"journal":{"name":"IEEE International Vacuum Electronics Conference. International Vacuum Electronics Conference","volume":"53 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2015-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Experimental study of thermal contact resistance between AlN and Kovar alloy by laser flash method\",\"authors\":\"Lin Zhang, Yan-ping Lu, B. Du\",\"doi\":\"10.1109/IVEC.2015.7223827\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the thermal contact resistance of solid interface between AlN and Kovar alloy and some main influencing factors of it were investigated. The thermal contact resistance of the interface between AlN ceramic and Kovar alloy decreases with increasing temperature and increasing pressure respectively, and thermal contact resistance between the unpolished samples is higher than that between polished samples. A function relation between pressure P applied on the AlN ceramic and Kovar alloy interface and the thermal contact resistance R is also presented.\",\"PeriodicalId\":88890,\"journal\":{\"name\":\"IEEE International Vacuum Electronics Conference. International Vacuum Electronics Conference\",\"volume\":\"53 1\",\"pages\":\"1-2\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-04-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE International Vacuum Electronics Conference. International Vacuum Electronics Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IVEC.2015.7223827\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE International Vacuum Electronics Conference. International Vacuum Electronics Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IVEC.2015.7223827","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文研究了AlN与Kovar合金固体界面的接触热阻及其主要影响因素。AlN陶瓷与Kovar合金界面的接触热阻分别随温度升高和压力升高而减小，未抛光试样之间的接触热阻高于抛光试样之间的接触热阻。给出了施加在AlN陶瓷和Kovar合金界面上的压力P与接触热阻R之间的函数关系。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Experimental study of thermal contact resistance between AlN and Kovar alloy by laser flash method

In this paper, the thermal contact resistance of solid interface between AlN and Kovar alloy and some main influencing factors of it were investigated. The thermal contact resistance of the interface between AlN ceramic and Kovar alloy decreases with increasing temperature and increasing pressure respectively, and thermal contact resistance between the unpolished samples is higher than that between polished samples. A function relation between pressure P applied on the AlN ceramic and Kovar alloy interface and the thermal contact resistance R is also presented.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

IEEE International Vacuum Electronics Conference. International Vacuum Electronics Conference

自引率

0.00%

发文量