熔体的电导率及其在Ge + As + Te体系中形成玻璃的能力

H. Krebs, P. Fischer
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引用次数: 26

摘要

在Ge + As + Te体系中,重Te原子有利于中间体pσ成键体系的形成。因此,玻璃形成区域很小,并且强烈依赖于淬火条件。与Ge + Sb + Se和Ge + As + Se体系一样,Ge + As + Te体系中的金属导电熔体即使在水中淬火也会凝固成结晶结构。然而,并不是所有属于这个系统的半导体熔体在这些条件下都变成玻璃状。正如预期的那样,从熔体固化到玻璃结构到那些固化到晶体结构的转变更加缓慢,从金属熔体到半导体熔体的转变也是如此。所有的半导体熔体在900到1000°C之间的温度下都或多或少地具有金属导电性。这种转变可以用对温度的抛物线依赖性或对数依赖性来描述。在硫族化合物体系中,熔炼过程往往与施加高压或强电场一样,具有相同的键合机制,具有类似的原子短程有序。这在高温下尤其如此。原子的强制迁移,它们更紧密的包装和电导率的影响通常在同一方向上起作用,增强了同一方向上的结构变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical conductivity of melts and their ability to form glasses in the system Ge + As + Te
In the system Ge + As + Te, the heavy Te atom facilitates the formation of mesomeric pσ-bonding systems. The glass forming regions are thus small and depend strongly on the quenching conditions. As in the systems Ge + Sb + Se and Ge + As + Se all metallically conducting melts in the system Ge + As + Te solidify to a crystallline structure even when quenched in water. However, not all semiconducting melts belonging to this system become glassy under these conditions. As expected, the transition from melts solidifying to a glass structure to those solidifying to a crystalline structure is more gradual, as is also the transition from metallic to semiconducting melts. All the semiconducting melts become more or less metallically conducting at temperatures between 900 and 1000 °C. The transition can be described by a parabolical or a log log dependence on temperature.In the chalcogenide systems the melting process often enforces the same bonding mechanism with similar atomic short range order as does the application of high pressures or of strong electric fields. This is especially the case at high temperatures. The enforced mobility of the atoms, their tighter packing and the effect of electrical conductivity often act in the same direction, enhancing structural changes in the same direction.
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