{"title":"光子带隙技术对微带器件封装效果的数值分析","authors":"Zhiyuan Yu, Weigan Lin","doi":"10.1109/ICIMW.2002.1076192","DOIUrl":null,"url":null,"abstract":"A numerical analysis is presented by the finite difference time domain method in this paper. A microstrip with an asymmetric metal bandgap structure which shows an extra-wide stop band is numerically analysed when its package is changed.","PeriodicalId":23431,"journal":{"name":"Twenty Seventh International Conference on Infrared and Millimeter Waves","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A numerical analysis of the effects of the packing of microstrip devices with photonic bandgap technique\",\"authors\":\"Zhiyuan Yu, Weigan Lin\",\"doi\":\"10.1109/ICIMW.2002.1076192\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A numerical analysis is presented by the finite difference time domain method in this paper. A microstrip with an asymmetric metal bandgap structure which shows an extra-wide stop band is numerically analysed when its package is changed.\",\"PeriodicalId\":23431,\"journal\":{\"name\":\"Twenty Seventh International Conference on Infrared and Millimeter Waves\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-12-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Twenty Seventh International Conference on Infrared and Millimeter Waves\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICIMW.2002.1076192\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Twenty Seventh International Conference on Infrared and Millimeter Waves","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICIMW.2002.1076192","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A numerical analysis of the effects of the packing of microstrip devices with photonic bandgap technique
A numerical analysis is presented by the finite difference time domain method in this paper. A microstrip with an asymmetric metal bandgap structure which shows an extra-wide stop band is numerically analysed when its package is changed.
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