聚异戊二烯/纳米结构碳复合材料在温度传感器中的应用

M. Knite, S. Zike, J. Zavickis, A. Linarts
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引用次数: 4

摘要

在90K-330K的温度区间内,研究了不同质量分数(8、9、10、11)填料浓度的聚异戊二烯(PI)基/高结构炭黑(HSCB)复合材料(PCBC)的电性能。本文主要研究了具有负温度电阻率(NTCR)的低温区域的直流(DC)电导率。在低温范围内,变程跳变(VRH)导通主要由载流子局域态间的跳变所主导。在较高的温度下,发生了最近邻跳频(NNH)电导率或恒程跳频电荷输运。电阻随温度变化的可逆性和小滞后表明了PCBC温度传感器的应用前景
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Polyisoprene/Nanostructured Carbon Composites for Applications in Temperature Sensors
The studies of electrical properties of the polyisoprene (PI) matrix/high structure carbon black (HSCB) composites (PCBC) with various concentrations (8, 9, 10 and 11 mass parts) of filler have been carried out in the temperature interval of 90K–330K. In this paper we focus on the investigation of direct current (DC) conductivity in a low-temperature region with negative temperature coefficient of resistivity (NTCR). It has been proven that variable range hopping (VRH) conduction is dominated by hopping of carriers among localized states in a low-temperature range. At higher temperatures the nearest neighbour hopping (NNH) conductivity or constant range hopping charge transport takes place. The reversibility as well as small hysteresis of resistance change versus temperature indicates prospective temperature sensor application for PCBC
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