一种模块化高压静电驱动器的小型化平台

IF 1 4区 工程技术 Q4 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS
Yanqiao Li, Bahlakoana Mabetha, J. Stauth
{"title":"一种模块化高压静电驱动器的小型化平台","authors":"Yanqiao Li, Bahlakoana Mabetha, J. Stauth","doi":"10.1109/COMPEL52896.2023.10221100","DOIUrl":null,"url":null,"abstract":"High voltage drivers are needed for electrostatic and piezoelectric actuators in small-scale electromechanical systems such as microrobotics and haptics. This paper presents a miniaturized platform for a modular switched-capacitor-based driver, implemented in a 180nm HV-SOI CMOS integrated circuit (IC), that uses less than 5 $\\mu$A quiescent current per chip and includes an auxiliary (magnetic) boost converter to interface with low-voltage (~2.5-3.7V) batteries. The platform allows multiple PCB modules to stack in series voltage domains, extending drive voltages to the kilovolt-range, beyond the process and buried-oxide (BOX) limits of a single chip. Compared to past work with the same IC [1], the improved platform achieves >100$\\times$ volume reduction and >30$\\times$ weight reduction; with eight boards stacked, the system can provide peak-peak drive voltages up to 3 kV from a 3.7V supply (voltage conversion ratios VCR >800), delivering and recovering ~1W reactive power with over 97% efficiency.","PeriodicalId":55233,"journal":{"name":"Compel-The International Journal for Computation and Mathematics in Electrical and Electronic Engineering","volume":"2 1","pages":"1-8"},"PeriodicalIF":1.0000,"publicationDate":"2023-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Miniaturized Platform for a Modular High-Voltage Electrostatic Actuator Driver\",\"authors\":\"Yanqiao Li, Bahlakoana Mabetha, J. Stauth\",\"doi\":\"10.1109/COMPEL52896.2023.10221100\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High voltage drivers are needed for electrostatic and piezoelectric actuators in small-scale electromechanical systems such as microrobotics and haptics. This paper presents a miniaturized platform for a modular switched-capacitor-based driver, implemented in a 180nm HV-SOI CMOS integrated circuit (IC), that uses less than 5 $\\\\mu$A quiescent current per chip and includes an auxiliary (magnetic) boost converter to interface with low-voltage (~2.5-3.7V) batteries. The platform allows multiple PCB modules to stack in series voltage domains, extending drive voltages to the kilovolt-range, beyond the process and buried-oxide (BOX) limits of a single chip. Compared to past work with the same IC [1], the improved platform achieves >100$\\\\times$ volume reduction and >30$\\\\times$ weight reduction; with eight boards stacked, the system can provide peak-peak drive voltages up to 3 kV from a 3.7V supply (voltage conversion ratios VCR >800), delivering and recovering ~1W reactive power with over 97% efficiency.\",\"PeriodicalId\":55233,\"journal\":{\"name\":\"Compel-The International Journal for Computation and Mathematics in Electrical and Electronic Engineering\",\"volume\":\"2 1\",\"pages\":\"1-8\"},\"PeriodicalIF\":1.0000,\"publicationDate\":\"2023-06-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Compel-The International Journal for Computation and Mathematics in Electrical and Electronic Engineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1109/COMPEL52896.2023.10221100\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Compel-The International Journal for Computation and Mathematics in Electrical and Electronic Engineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/COMPEL52896.2023.10221100","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS","Score":null,"Total":0}
引用次数: 0

摘要

在微型机器人和触觉等小型机电系统中,静电和压电致动器需要高压驱动器。本文提出了一个模块化开关电容驱动的小型化平台,实现在180nm HV-SOI CMOS集成电路(IC)中,每个芯片的静态电流小于5 $\mu$ a,并包括一个辅助(磁性)升压转换器,用于与低压(~2.5-3.7V)电池接口。该平台允许多个PCB模块在串联电压域中堆叠,将驱动电压扩展到千伏范围,超越了单个芯片的工艺和埋地氧化物(BOX)限制。与过去使用相同IC[1]的工作相比,改进的平台实现了>体积减小100美元,>重量减小30美元;通过8块板堆叠,该系统可以从3.7V电源(电压转换比VCR bbb800)提供高达3kv的峰值驱动电压,以超过97%的效率提供和回收约1W的无功功率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Miniaturized Platform for a Modular High-Voltage Electrostatic Actuator Driver
High voltage drivers are needed for electrostatic and piezoelectric actuators in small-scale electromechanical systems such as microrobotics and haptics. This paper presents a miniaturized platform for a modular switched-capacitor-based driver, implemented in a 180nm HV-SOI CMOS integrated circuit (IC), that uses less than 5 $\mu$A quiescent current per chip and includes an auxiliary (magnetic) boost converter to interface with low-voltage (~2.5-3.7V) batteries. The platform allows multiple PCB modules to stack in series voltage domains, extending drive voltages to the kilovolt-range, beyond the process and buried-oxide (BOX) limits of a single chip. Compared to past work with the same IC [1], the improved platform achieves >100$\times$ volume reduction and >30$\times$ weight reduction; with eight boards stacked, the system can provide peak-peak drive voltages up to 3 kV from a 3.7V supply (voltage conversion ratios VCR >800), delivering and recovering ~1W reactive power with over 97% efficiency.
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来源期刊
CiteScore
1.60
自引率
0.00%
发文量
124
审稿时长
4.2 months
期刊介绍: COMPEL exists for the discussion and dissemination of computational and analytical methods in electrical and electronic engineering. The main emphasis of papers should be on methods and new techniques, or the application of existing techniques in a novel way. Whilst papers with immediate application to particular engineering problems are welcome, so too are papers that form a basis for further development in the area of study. A double-blind review process ensures the content''s validity and relevance.
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