气泡诱导的石墨烯强热收缩

IF 2.8 4区 工程技术 Q2 ENGINEERING, MECHANICAL
Zhaozhao Qu, Chuan-Xin Cui, Jinyong Jiang
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引用次数: 0

摘要

范德华层状结构的热膨胀系数对控制先进光电设备的可靠性和寿命至关重要。气泡通常存在于层状结构中,但其对结构热膨胀系数的影响尚不清楚。利用弹性膜理论和改进的范德华气体状态方程,推导出气泡对长度变化影响的解析公式。结果表明,随着温度的升高,气泡可以在少量层的石墨烯结构中引起明显的热收缩。通过分子动力学模拟验证了分析预测结果,验证了所提模型的准确性和可靠性。这些发现对于增强我们对依赖于范德华层状结构的功能设备的可靠性和耐用性的理解具有重要价值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Bubble-Induced Strong Thermal Contraction For Graphene
The thermal expansion coefficient of van der Waals layered structures is of crucial importance in governing the dependability and longevity of advanced optoelectronic equipment. Bubbles are commonly found within layered structures, yet their impact on the thermal expansion coefficient of the structure is still not well understood. We derive an analytical formula that describes the influence of bubbles on the variation in length, utilizing both the elastic membrane theory and the improved van der Waals gas state equation. The results demonstrate that as the temperature increases, bubbles can induce significant thermal contraction in few-layer graphene structures. The analytical predictions are validated through molecular dynamic simulations, confirming the accuracy and reliability of the proposed model. These findings hold significant value in enhancing our understanding of the dependability and durability of functional equipment that relies on van der Waals layered structures.
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来源期刊
自引率
0.00%
发文量
182
审稿时长
4.7 months
期刊介绍: Topical areas including, but not limited to: Biological heat and mass transfer; Combustion and reactive flows; Conduction; Electronic and photonic cooling; Evaporation, boiling, and condensation; Experimental techniques; Forced convection; Heat exchanger fundamentals; Heat transfer enhancement; Combined heat and mass transfer; Heat transfer in manufacturing; Jets, wakes, and impingement cooling; Melting and solidification; Microscale and nanoscale heat and mass transfer; Natural and mixed convection; Porous media; Radiative heat transfer; Thermal systems; Two-phase flow and heat transfer. Such topical areas may be seen in: Aerospace; The environment; Gas turbines; Biotechnology; Electronic and photonic processes and equipment; Energy systems, Fire and combustion, heat pipes, manufacturing and materials processing, low temperature and arctic region heat transfer; Refrigeration and air conditioning; Homeland security systems; Multi-phase processes; Microscale and nanoscale devices and processes.
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