三维堆叠集成电路中热插入的空白再分配

2007 25th International Conference on Computer Design Pub Date : 2007-10-01 DOI:10.1109/ICCD.2007.4601912

E. Wong, S. Lim

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引用次数: 15

摘要

3D堆叠IC设计的最大挑战之一是散热。结合热通孔是降低3D集成电路温度的一种很有前途的方法。器件层之间的键合方式对热通孔可能插入的位置施加了一定的限制。本文提出了一种考虑键合方式的空白重新分配算法，通过放置来改善散热，从而降低温度。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Whitespace redistribution for thermal via insertion in 3D stacked ICs

One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding styles between device layers impose certain restrictions to where thermal vias may be inserted. This paper presents a whitespace redistribution algorithm that takes bonding style into consideration to improve thermal via placement, which in turn reduces temperature.

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2007 25th International Conference on Computer Design

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