无铅焊料粘度测量的现状与展望

IF 0.5 4区材料科学 Q4 METALLURGY & METALLURGICAL ENGINEERING

Journal of The Japan Institute of Metals Pub Date : 2017-01-01 DOI:10.2320/JINSTMET.J2016066

Yasutaka Hashimoto, T. Nishi, H. Ohta

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引用次数: 0

摘要

无铅焊料的黏度是模拟无铅焊料制造过程的重要指标。本文综述了无铅焊料粘度测量的现状。此外，本文还介绍了利用同心圆柱主轴几何形状旋转粘度计测量无铅焊料粘度的工作现状。(doi: 10.2320 / jinstmet.J2016066)

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Current Status and Future Plan of the Viscosity Measurement for the Lead-Free Solder

The viscosities of the lead–free solders are important to simulate the process of the manufacturing process. In this article, current status of the viscosity measurements for the lead–free solders are reviewed. In addition, we introduced the current work of the viscosity measurements for the lead–free solders by using the rotational viscometer with concentric cylinder spindle geometry. [doi:10.2320/jinstmet.J2016066]

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来源期刊

Journal of The Japan Institute of Metals 工程技术-冶金工程

CiteScore

0.70

自引率

0.00%

发文量

审稿时长

6-12 weeks

期刊介绍： Information not localized