安全芯片电路与封装系统设计

M. Nagata
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引用次数: 0

摘要

面向硬件的半导体集成电路(IC)芯片的安全性和可靠性已经得到了很高的要求。本文概述了用于安全应用的IC芯片电路和封装系统的要求和最新发展,特别强调了对物理实现攻击的保护。一旦在硅中实现加密算法,通过芯片前端的电力输送网络(pdn),甚至通过硅衬底的背面,以功率电压变化和电磁波发射的形式,功率侧通道就不希望存在于加密电路中。预防措施已与电路设计和封装技术开发
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of Circuits and Packaging Systems for Security Chips
SUMMARY Hardware oriented security and trust of semiconductor integrated circuit (IC) chips have been highly demanded. This paper outlines the requirements and recent developments in circuits and packaging systems of IC chips for security applications, with the particular emphasis on protections against physical implementation attacks. Power side channels are of undesired presence to crypto circuits once a crypto algorithm is implemented in Silicon, over power delivery networks (PDNs) on the frontside of a chip or even through the backside of a Si substrate, in the form of power voltage variation and electromagnetic wave emanation. Pre-ventive measures have been exploited with circuit design and packaging technologies
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