用轴载吸塑试验评价膜-基材界面耐久性

K. Liao, K. Wan
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引用次数: 11

摘要

本文给出了薄膜-衬底系统轴载泡罩试验的解析解。该模型同时考虑了薄膜的弯曲变形和拉伸变形。结果表明,在I型分离载荷下,薄膜-衬底的分层行为是由一个参数控制的,该参数将薄膜应力与薄膜的刚度联系起来。研究了几种模型薄膜-衬底体系在重复机械载荷作用下的分层行为。结果表明,循环载荷作用下薄膜-衬底的分层与薄膜刚度、加载频率和薄膜-衬底界面特性有关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evaluation of Film-Substrate Interface Durability Using a Shaft-Loaded Blister Test
In this paper, an analytical solution is presented for a shaft-loaded blister test for a thin film-substrate system. Both bending and stretching modes of deformation of the film are considered in the model. It is suggested that film-substrate delamination behavior under a Mode I separation load is governed by a parameter that relates the membrane stress to the rigidity of the film. The delamination behavior of several model thin film-substrate systems under repeated mechanical loads is studied. It is suggested from the results that film-substrate delamination under cyclic load depends on film rigidity, loading frequency, and film-substrate interfacial characteristics.
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